03
'26
Written on
Keysight technologies News
02
'26
Written on
e-con Systems News
Edge AI Vision Platforms for Multi-Camera Systems
e-con Systems presents edge AI and multi-camera vision technologies for robotics, mobility, and industrial applications at NVIDIA GTC 2026 and Embedded World 2026.
02
'26
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Siemens digital Industry Software News
Siemens Adds Agentic AI to Chip Verification
New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.
02
'26
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NEC Corporation News
NEC Enables Hybrid Cloud-Edge UPF Deployment
Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.
02
'26
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Toshiba News
High-side ideal diode controller for automotive applications with reverse polarity protection
Toshiba Electronics Europe presents a compact high-side ideal diode controller for protected and redundant automotive power architecture.
27
'26
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Seco News
Edge AI Platforms for Industrial Systems
SECO and Qualcomm Technologies combine Dragonwing platforms and Clea software to deploy scalable edge computing solutions for industrial automation, smart grid, and advanced HMI applications.
27
'26
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Infineon News
Integrated 600 V GaN Half-Bridge Simplifies Power Design
Infineon introduces compact driver-integrated power stage for motor drives and switched-mode supplies requiring efficient high-frequency conversion.
27
'26
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STMicroelectronics News
75V Motor Driver ICs Target 48V Industrial Systems
STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.
27
'26
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SK Hynix News
SK hynix Advances HBF Standardization with Sandisk
A joint Open Compute Project workstream aims to define High Bandwidth Flash as a new scalable, power-efficient memory tier for AI inference infrastructure.
27
'26
Written on
Keysight technologies News
