System integration approach combines congatec’s AI-enabled COM Express modules with platform-level design expertise for industrial, medical and transportation deployments.
Program structures national partnerships to accelerate OSM-based Systems-on-Module development for embedded applications across industrial and medical sectors.
Partnership with Qualcomm expands chipset integration across smartphones and connected devices to enhance performance, AI processing and system-level optimization.
At Embedded World 2026 , Anritsu Corporation demonstrated how IoT device manufacturers use RF and signal integrity testing to improve wireless reliability and reduce redesign risks.
Advanced RF, power consumption and high-speed signal-integrity solutions enable reliable IoT device validation from wireless connectivity to PCIe Gen6 compliance.