05 {{ "2021-03-05T00:00:00+00:00" | date "MMM" }} '21

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Congatec News

congatec starter set for COM-HPC with 11th Gen Intel Core processors

Getting in the fast lane to Gen4.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

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NXP News

NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Comau News

Comau North America teams up with wearable robotics association to present MATE-XT webinar

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Adlinktech News

ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Baumer News

Compact machine designs without compromise

Miniaturized laser distance sensors from Baumer reliably handle precise measurement tasks.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Calumetelectronics News

Calumet Electronics becomes America’s only HUBZone Certified PCB supplier

DoD supply chain to benefit from Calumet Electronics’ SBA HUBZone designation.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Adlinktech News

Canonical to Pre-Certify ADLINK Devices with Ubuntu Linux Operating System

Pre-installed Ubuntu Linux ensures ADLINK devices are tested and validated, with ongoing support and automatic updates for devices deployed in the field.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Acceed News

Acceed confirms DDS partnership with Adlink

The German distributor Acceed and the globally operating manufacturer Adlink are connected with a partnership which has already existed for several decades.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC DOUBLES PERFORMANCE WITH AMD RYZEN EMBEDDED V2000 PROCESSOR

Congatec – a leading vendor of embedded and edge computing technology – introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors.

Read more…

04 {{ "2021-03-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-04T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches Thin and Compact LDO Regulators that Help to Reduce Device Size and Stabilize Power Line Output

TOKYO—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCR5RG series” of 45 LDO regulators, all housed in a thin, compact WCSP4F package. The industry-leading[1] high ripple rejection ratio[2] of the new LDO regulators bring enhanced power stabilization to DC power lines for mobile devices, such as wearables. Volume shipments start today.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

congatec starter set for COM-HPC with 11th Gen Intel Core processors

Getting in the fast lane to Gen4.

NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.

Comau North America teams up with wearable robotics association to present MATE-XT webinar

On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).

ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design

ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.

Compact machine designs without compromise

Miniaturized laser distance sensors from Baumer reliably handle precise measurement tasks.

Calumet Electronics becomes America’s only HUBZone Certified PCB supplier

DoD supply chain to benefit from Calumet Electronics’ SBA HUBZone designation.

Canonical to Pre-Certify ADLINK Devices with Ubuntu Linux Operating System

Pre-installed Ubuntu Linux ensures ADLINK devices are tested and validated, with ongoing support and automatic updates for devices deployed in the field.

Acceed confirms DDS partnership with Adlink

The German distributor Acceed and the globally operating manufacturer Adlink are connected with a partnership which has already existed for several decades.

CONGATEC DOUBLES PERFORMANCE WITH AMD RYZEN EMBEDDED V2000 PROCESSOR

Congatec – a leading vendor of embedded and edge computing technology – introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors.

Toshiba Launches Thin and Compact LDO Regulators that Help to Reduce Device Size and Stabilize Power Line Output

International