Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TB9120AFTG,” a constant-current 2-phase stepping motor driver for automotive applications. The new IC outputs a sine-wave current using only a simple clock input interface, with no need for an advanced functional MCU or dedicated software.
Congatec – a leading vendor of embedded computing technology – extends its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series.
BittWare, a Molex company, the leading supplier of enterprise-class NVMe computational storage products featuring FPGA technology, today announces the launch of the 250-M2D Accelerator Module.
binder, one of the industry and technology leaders in the field of industrial circular connectors, has expanded its Harsh Environment Connector (HEC) series 696 with some important models. The previous product range is supplemented by flange and cable variants with built-in protective conduit adaptation.