01
'20
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Emcab News
01
'20
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Flex Power Modules News
Flex Power Modules leverages O-RAN to grow presence in RFPA market
In line with the world’s rapidly advancing 5G cellular wireless networks, Flex Power Modules is working closely with both OpenRAN, and O-RAN Alliance – a global community of more than 160 mobile operators, vendors, and research and academic institutions operating in the Radio Access Network (RAN) industry. By doing so it is growing its presence in the associated RFPA (radio frequency power amplifier) market, and broadening its range of isolated DC/DC converters for RFPA.
30
'20
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Silicon Labs News
Silicon Labs Strengthens Commitment to Wi-SUN as Scalable, Open LPWAN Standard for Smart City, Smart Utility and Industrial IoT
Joins Wi-SUN Alliance Board of Directors to Advance Widely Used Mesh Networking Standard.
30
'20
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Infineon News
New silicon carbide power module for electric vehicles
Silicon carbide in electric vehicles stands for more efficiency, higher power density and performance.
30
'20
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Toshiba News
TOSHIBA RELEASES INDUSTRY’S FIRST HIGH-SPEED COMMUNICATIONS. PHOTOCOUPLERS THAT CAN OPERATE FROM A 2.2V SUPPLY
New devices support low-voltage peripheral circuits and facilitate reductions in component count.
30
'20
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ST News
STMicroelectronics Extends USB Fast Charging over USB-C® to Embedded Applications with USB-IF-Certified Development Board
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is facilitating modernization of battery-powered products to capture the advantages of the latest USB Power Delivery (USB PD) technology including faster charging and easy reuse of USB-C® chargers and cables.
30
'20
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Nexperia News
Nexperia launches ‘Power Live’ July 2nd & 3rd 2020
Participate in live discussions on GaN, Silicon Germanium, Automotive, Packaging and more; view on-demand video demos.
29
'20
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Infineon News
A class of its own: Advanced H2S protection of IGBT modules enhances lifetime
Ruggedness determines the longevity and thus the reliability of modules for applications used in harsh environments.
29
'20
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Infineon News
CoolSiC™ 62 mm module opens up new applications for silicon carbide
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds another industry standard package to its CoolSiC™ MOSFET 1200 V module family.
29
'20
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Stemmer imaging News
