27 {{ "2025-08-27T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-27T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Introduces PLEC69B Thin-Film Inductors for AI Optical Transceivers

PLEC69B offers 10 μH in 1206 size, 70% lower DC resistance, 0.2 A rated current, and 10–200 MHz impedance range.

Read more…

27 {{ "2025-08-27T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-27T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Introduces Smart Bench Essentials Plus

New portfolio of core bench instruments exceeds industry and safety standards so engineers can safeguard the integrity of designs.

Read more…

27 {{ "2025-08-27T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces 75 mΩ industrial CoolSiC MOSFETs 650 V G2

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation.

Read more…

26 {{ "2025-08-26T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-26T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

Panasonic's new Bluetooth 6.0 module offers high performance, low power

Panasonic’s PAN B611-1 Bluetooth module, based on Nordic nRF54L15, supports Bluetooth 6.0, Channel Sounding, and Matter applications, offering high performance, low power, and precise distance measurement.

Read more…

25 {{ "2025-08-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-25T00:00:00+00:00" | date "longDate" }}

Aetina

Aetina Launches “Preview Kits” Accelerated by NVIDIA Jetson Thor for Advanced Robotics and Physical AI

Aetina, a leading provider of edge AI solutions, today announced the availability of limited Preview Kits built on the groundbreaking NVIDIA^® Jetson Thor™ Platform, enabling developers worldwide to accelerate innovation in next-generation robotics and physical AI applications.

Read more…

22 {{ "2025-08-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-22T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

Texas Instruments powers ISRO’s NISAR mission with space-grade semiconductors

NISAR’s dual-band radar captures global Earth data every 12 days using TI’s radiation-hardened chips, optimizing power, precision and performance.

Read more…

22 {{ "2025-08-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-22T00:00:00+00:00" | date "longDate" }}

Kyocera News

Kyocera Launches 5908 Series Fully Shielded 0.4 mm Pitch Connector

Features double shielding for superior EMI suppression, supports PCIe Gen3 (8 Gbps) and USB 3.2 Gen2 (10 Gbps), with 30% higher retention.

Read more…

22 {{ "2025-08-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-22T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Completes Industry-First PSA Certified Level 4 Evaluation for Silicon Labs’ SiXG301 SoC

Keysight conducted the Level 4 evaluation through its advanced security lab, employing in-depth design reviews, vulnerability analysis, and sophisticated attack simulations.

Read more…

21 {{ "2025-08-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-21T00:00:00+00:00" | date "longDate" }}

Fischer Elektronik News

Fischer Elektronik offers the smallest ribbon heatsinks

The ICK SMD heat sinks are available as Tape & Reel in various sizes, with black anodized or solderable coating, Kapton dot assembly aid, and customer-specific adaptations.

Read more…

21 {{ "2025-08-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-08-21T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Unveils Ultra-Low Power MCU for Secure Metering Systems

Renesas' RA4C1 MCU group combines an 80MHz Arm Cortex-M33 core, PSA Certified security, and 168 µA/MHz active power consumption for smart metering and building automation applications.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

TDK Introduces PLEC69B Thin-Film Inductors for AI Optical Transceivers

PLEC69B offers 10 μH in 1206 size, 70% lower DC resistance, 0.2 A rated current, and 10–200 MHz impedance range.

Keysight Introduces Smart Bench Essentials Plus

New portfolio of core bench instruments exceeds industry and safety standards so engineers can safeguard the integrity of designs.

Infineon introduces 75 mΩ industrial CoolSiC MOSFETs 650 V G2

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation.

Panasonic's new Bluetooth 6.0 module offers high performance, low power

Panasonic’s PAN B611-1 Bluetooth module, based on Nordic nRF54L15, supports Bluetooth 6.0, Channel Sounding, and Matter applications, offering high performance, low power, and precise distance measurement.

Aetina Launches “Preview Kits” Accelerated by NVIDIA Jetson Thor for Advanced Robotics and Physical AI

Aetina, a leading provider of edge AI solutions, today announced the availability of limited Preview Kits built on the groundbreaking NVIDIA^® Jetson Thor™ Platform, enabling developers worldwide to accelerate innovation in next-generation robotics and physical AI applications.

Texas Instruments powers ISRO’s NISAR mission with space-grade semiconductors

NISAR’s dual-band radar captures global Earth data every 12 days using TI’s radiation-hardened chips, optimizing power, precision and performance.

Kyocera Launches 5908 Series Fully Shielded 0.4 mm Pitch Connector

Features double shielding for superior EMI suppression, supports PCIe Gen3 (8 Gbps) and USB 3.2 Gen2 (10 Gbps), with 30% higher retention.

Keysight Completes Industry-First PSA Certified Level 4 Evaluation for Silicon Labs’ SiXG301 SoC

Keysight conducted the Level 4 evaluation through its advanced security lab, employing in-depth design reviews, vulnerability analysis, and sophisticated attack simulations.

Fischer Elektronik offers the smallest ribbon heatsinks

The ICK SMD heat sinks are available as Tape & Reel in various sizes, with black anodized or solderable coating, Kapton dot assembly aid, and customer-specific adaptations.

Renesas Unveils Ultra-Low Power MCU for Secure Metering Systems

Renesas' RA4C1 MCU group combines an 80MHz Arm Cortex-M33 core, PSA Certified security, and 168 µA/MHz active power consumption for smart metering and building automation applications.

International

Market Overview

Technical Articles

Case studies

PLEC69B offers 10 μH in 1206 size, 70% lower DC resistance, 0.2 A rated current, and 10–200 MHz impedance range.

New portfolio of core bench instruments exceeds industry and safety standards so engineers can safeguard the integrity of designs.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation.

Panasonic’s PAN B611-1 Bluetooth module, based on Nordic nRF54L15, supports Bluetooth 6.0, Channel Sounding, and Matter applications, offering high performance, low power, and precise distance measurement.

Aetina, a leading provider of edge AI solutions, today announced the availability of limited Preview Kits built on the groundbreaking NVIDIA® Jetson Thor™ Platform, enabling developers worldwide to accelerate innovation in next-generation robotics and physical AI applications.

NISAR’s dual-band radar captures global Earth data every 12 days using TI’s radiation-hardened chips, optimizing power, precision and performance.

Features double shielding for superior EMI suppression, supports PCIe Gen3 (8 Gbps) and USB 3.2 Gen2 (10 Gbps), with 30% higher retention.

Keysight conducted the Level 4 evaluation through its advanced security lab, employing in-depth design reviews, vulnerability analysis, and sophisticated attack simulations.

The ICK SMD heat sinks are available as Tape & Reel in various sizes, with black anodized or solderable coating, Kapton dot assembly aid, and customer-specific adaptations.

Renesas' RA4C1 MCU group combines an 80MHz Arm Cortex-M33 core, PSA Certified security, and 168 µA/MHz active power consumption for smart metering and building automation applications.

International

Aetina, a leading provider of edge AI solutions, today announced the availability of limited Preview Kits built on the groundbreaking NVIDIA^® Jetson Thor™ Platform, enabling developers worldwide to accelerate innovation in next-generation robotics and physical AI applications.