15 {{ "2025-10-15T00:00:00+00:00" | date "MMM" }} '25

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Broadcom News

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

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Nvidia News

NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-14T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

TE advances next-generation high-density data centers at the 2025 OCP Global Summit

TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.

Read more…

14 {{ "2025-10-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-14T00:00:00+00:00" | date "longDate" }}

TDK News

TDK to showcase ultra-low-power sensing and processing solution powered by Renesas

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

Read more…

13 {{ "2025-10-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-13T00:00:00+00:00" | date "longDate" }}

Allied Market Research

FPGA Market Growth Forecast through 2030

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

Read more…

10 {{ "2025-10-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-10T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron and EIZO Partner to Deliver Integrated VPX CPU/GPU Platforms

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

Read more…

10 {{ "2025-10-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-10T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik Expands Wireless Portfolio with Nordic's High-Performance SoC

Rutronik now offers Nordic's nRF54LM20A SoC with 2 MB NVM, 512 KB RAM, and an Arm Cortex-M33 core for advanced Bluetooth LE and Matter designs.

Read more…

10 {{ "2025-10-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-10T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Unveils Compact Automotive Surge-Protection Diodes

The new XCEZ series in a 1.6×0.8 mm SOD-523 package delivers low dynamic resistance, 6 W surge endurance, and AEC-Q101 reliability for space-constrained automotive systems.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Expands AI Data Center Power Protection

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

AMD News

AMD 5th Gen EPYC Processors Power AWS Instances

AMD EPYC 5th Gen processors now power the new Amazon EC2 M8a cloud instances, delivering up to 30% higher performance than the previous generation for general-purpose, high-performance computing workloads on AWS.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

NVIDIA Unveils DGX Spark, the World’s Smallest AI Supercomputer

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

TE advances next-generation high-density data centers at the 2025 OCP Global Summit

TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.

TDK to showcase ultra-low-power sensing and processing solution powered by Renesas

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

FPGA Market Growth Forecast through 2030

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

Kontron and EIZO Partner to Deliver Integrated VPX CPU/GPU Platforms

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

Rutronik Expands Wireless Portfolio with Nordic's High-Performance SoC

Rutronik now offers Nordic's nRF54LM20A SoC with 2 MB NVM, 512 KB RAM, and an Arm Cortex-M33 core for advanced Bluetooth LE and Matter designs.

Toshiba Unveils Compact Automotive Surge-Protection Diodes

The new XCEZ series in a 1.6×0.8 mm SOD-523 package delivers low dynamic resistance, 6 W surge endurance, and AEC-Q101 reliability for space-constrained automotive systems.

Infineon Expands AI Data Center Power Protection

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

AMD 5th Gen EPYC Processors Power AWS Instances

AMD EPYC 5th Gen processors now power the new Amazon EC2 M8a cloud instances, delivering up to 30% higher performance than the previous generation for general-purpose, high-performance computing workloads on AWS.

International

Technical Articles

New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices.

The compact DGX Spark delivers 1 petaflop performance and 128GB unified memory, enabling developers to run 200B-parameter AI models locally.

TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.

The new reference board combines the Renesas RA2L2 MCU with a 48 MHz Arm Cortex-M23 and USB Type-C 2.4 support, and the InvenSense ICM-42688-P 6-axis MEMS sensor with 2.8 mdps/√Hz gyro and 70 µg/√Hz accelerometer noise.

According to a study by Allied Market Research, the global FPGA component market is expected to experience significant growth between 2021 and 2030.

Kontron integrates EIZO’s NVIDIA-based GPU technology into its VPX systems, delivering rugged, mission-ready CPU/GPU platforms with TSN-enabled interoperability for defense applications.

Rutronik now offers Nordic's nRF54LM20A SoC with 2 MB NVM, 512 KB RAM, and an Arm Cortex-M33 core for advanced Bluetooth LE and Matter designs.

The new XCEZ series in a 1.6×0.8 mm SOD-523 package delivers low dynamic resistance, 6 W surge endurance, and AEC-Q101 reliability for space-constrained automotive systems.

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

AMD EPYC 5th Gen processors now power the new Amazon EC2 M8a cloud instances, delivering up to 30% higher performance than the previous generation for general-purpose, high-performance computing workloads on AWS.

International

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.