Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.
SVS-Vistek's SenSWIR FXO cameras use a 400-1700 nm range to identify subsurface wafer flaws, offering 5.2MP resolution and TEC cooling for high-speed inspection.
Deca and SST, a Microchip subsidiary, combine SuperFlash, M-Series fan-out, and Adaptive Patterning technologies to deliver modular NVM chiplets for scalable, efficient multi-die semiconductor architectures.
aReady.COM is congatec’s streamlined solution to accelerate embedded system development that delivers pre-integrated and pre-validated hardware and software building blocks.