01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti Unveils Hybrid Memory for On-Chip AI Training

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

Read more…

01 {{ "2025-10-01T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-01T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

Texas Instruments Unveils DLP991UUV for High-Resolution Digital Lithography

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

Read more…

29 {{ "2025-09-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-29T00:00:00+00:00" | date "longDate" }}

PickeringTest News

Pickering Unveils New 5A Battery Simulator

The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.

Read more…

29 {{ "2025-09-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-29T00:00:00+00:00" | date "longDate" }}

TDK News

TDK at SEMICON West 2025

TDK will showcase its latest semiconductor technologies at SEMICON West 2025, across three booths, October 7–9 in Phoenix, AZ.

Read more…

29 {{ "2025-09-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-29T00:00:00+00:00" | date "longDate" }}

ARBOR Technology News

ARBOR SP-241C-1N305: Rugged Fanless Industrial Panel PC

Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.

Read more…

26 {{ "2025-09-26T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-26T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip launches MCP9604 four-channel thermocouple IC with ±1.5°C accuracy

Microchip’s MCP9604 IC enables precise four-channel thermocouple measurement, ±1.5°C accuracy, supports -200°C to +1372°C range, reducing 15 discrete components.

Read more…

26 {{ "2025-09-26T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-26T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

Siemens TSMC Advance Chip Design

Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.

Read more…

25 {{ "2025-09-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-25T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Launches DC Motor 31 Click for Precise Control

Supporting 8.2–44 V and up to 4 A output, the compact Click board integrates PWM current drive, torque adjustment, fault monitoring, and rapid prototyping for industrial robotics.

Read more…

25 {{ "2025-09-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-25T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik Adds Omron G9JH-1-E DC Relay for Inrush Protection

Weighing just 36 g, the smallest DC relay in the industry, Omron’s G9JH-1-E, available via Rutronik, withstands 100,000+ switches, 30 A inrush, -40 °C to +85 °C, and 4,500 V impulse.

Read more…

25 {{ "2025-09-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-25T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM and Infineon Collaborate on Flexible SiC Power Packages

Mutual adoption of top-side cooling and DOT-247 packages enhances thermal performance, doubles power density, and provides customers with interchangeable SiC solutions for EV, AI, and renewable applications.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

CEA-Leti Unveils Hybrid Memory for On-Chip AI Training

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

Texas Instruments Unveils DLP991UUV for High-Resolution Digital Lithography

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

Pickering Unveils New 5A Battery Simulator

The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.

TDK at SEMICON West 2025

TDK will showcase its latest semiconductor technologies at SEMICON West 2025, across three booths, October 7–9 in Phoenix, AZ.

ARBOR SP-241C-1N305: Rugged Fanless Industrial Panel PC

Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.

Microchip launches MCP9604 four-channel thermocouple IC with ±1.5°C accuracy

Microchip’s MCP9604 IC enables precise four-channel thermocouple measurement, ±1.5°C accuracy, supports -200°C to +1372°C range, reducing 15 discrete components.

Siemens TSMC Advance Chip Design

Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.

MIKROE Launches DC Motor 31 Click for Precise Control

Supporting 8.2–44 V and up to 4 A output, the compact Click board integrates PWM current drive, torque adjustment, fault monitoring, and rapid prototyping for industrial robotics.

Rutronik Adds Omron G9JH-1-E DC Relay for Inrush Protection

Weighing just 36 g, the smallest DC relay in the industry, Omron’s G9JH-1-E, available via Rutronik, withstands 100,000+ switches, 30 A inrush, -40 °C to +85 °C, and 4,500 V impulse.

ROHM and Infineon Collaborate on Flexible SiC Power Packages

Mutual adoption of top-side cooling and DOT-247 packages enhances thermal performance, doubles power density, and provides customers with interchangeable SiC solutions for EV, AI, and renewable applications.

International

Technical Articles

CEA-Leti and French research partners created a CMOS-compatible hybrid memory combining ferroelectric capacitors and memristors, enabling adaptive on-chip AI learning and inference for edge devices.

The DLP991UUV features 8.9M pixels, sub-micron resolution, and 110 gigapixels/sec throughput, enabling scalable, cost-effective maskless lithography for advanced packaging.

The next-gen 5A PXI/PXIe battery simulator enables precise BMS testing with four fully isolated channels per slot, high-current drive, and integrated hardware safety features.

TDK will showcase its latest semiconductor technologies at SEMICON West 2025, across three booths, October 7–9 in Phoenix, AZ.

Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.

Microchip’s MCP9604 IC enables precise four-channel thermocouple measurement, ±1.5°C accuracy, supports -200°C to +1372°C range, reducing 15 discrete components.

Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.

Supporting 8.2–44 V and up to 4 A output, the compact Click board integrates PWM current drive, torque adjustment, fault monitoring, and rapid prototyping for industrial robotics.

Weighing just 36 g, the smallest DC relay in the industry, Omron’s G9JH-1-E, available via Rutronik, withstands 100,000+ switches, 30 A inrush, -40 °C to +85 °C, and 4,500 V impulse.

Mutual adoption of top-side cooling and DOT-247 packages enhances thermal performance, doubles power density, and provides customers with interchangeable SiC solutions for EV, AI, and renewable applications.

International

Supporting 8.2–44 V and up to 4 A output, the compact Click board integrates PWM current drive, torque adjustment, fault monitoring, and rapid prototyping for industrial robotics.

Weighing just 36 g, the smallest DC relay in the industry, Omron’s G9JH-1-E, available via Rutronik, withstands 100,000+ switches, 30 A inrush, -40 °C to +85 °C, and 4,500 V impulse.