binder enhances component reliability with custom PUR foaming and potting processes, ensuring optimal protection for sensitive electromechanical and electronic assemblies.
Micron’s 1-gamma LPDDR5X delivers industry-leading 10.7Gbps speed, 20% power savings, and the thinnest package, enabling faster, energy-efficient AI on flagship smartphones.
JUMPtec unveils new COM and SMARC modules powered by Intel Core 3 and N-Series processors, delivering enhanced performance for embedded and edge computing applications.
Comau will work with Intecells to develop a cost-effective technology path for customers looking to integrate the new technology within existing cell manufacturing lines.
Murata’s NXJ1T series offers compact, high-isolation 1W DC-DC converters for demanding industrial, medical, and energy applications with exceptional reliability.
Würth Elektronik's Skoll-I is a compact, certified module combining Bluetooth Classic and LE 5.4, enabling fast, global deployment of new wireless applications.
With cleanroom-compliant robotics and modular systems designed for giga-scale production, Comau underscored its commitment to accelerating the global battery manufacturing transition.