Rohde & Schwarz, a member of the industry body IEEE and OPEN Alliance, is accelerating the development of the new automotive Ethernet variant 10BASE-T1S by offering compliance and trigger & decode options.
Supports latest interconnect standards, including Universal Chiplet Interconnect Express™ 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility.
Infineon’s new MOSFETs feature ultra-low RDS(on), superior thermal performance, and high switching efficiency, making them ideal for EV and industrial applications such as chargers, converters, eFuses, and solid-state relays.
SMA Solar Technology AG, adopts Semikron Danfoss’ Module with ROHM's latest 2kV SiC MOSFETs inside its new large scale solar system “Sunny Central FLEX”.
congatec presents modular computing platforms, including COM-HPC, SMARC, and COM Express ecosystems, enabling scalable, energy-efficient, and rugged embedded solutions.