18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric US

Mitsubishi Electric Automation, Inc. Welcomes New Managing Director for Mexico and Latin America, Edgar Romero

Edgar Romero will serve as Managing Director for Mexico and Latin America at Mitsubishi Electric Automation to improve the company's performance and profitability in Mexico and Latin America.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Unveils Human Presence Detection to Enhance PC User Experience

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

CEA Leti News

Applied Materials and CEA-Leti Expand Joint Lab to Pioneer Energy-Efficient AI Chips

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

Read more…

18 {{ "2025-06-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-18T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Unveils VMware Cloud Foundation 9.0

VCF 9.0 combines public cloud agility with private cloud control, boosting innovation, cost-efficiency, and security.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Launches Compact MG36021A Synthesiser

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Builds the Future of AI with Optimized Solutions for NVIDIA 800V Architecture

ROHM supports NVIDIA’s 800V HVDC AI data centers with advanced SiC and GaN power semiconductors, enabling efficient, scalable, and sustainable high-voltage power infrastructure.

Read more…

17 {{ "2025-06-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-17T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight, NTT Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G

Achieved 280 Gbps in the 300 GHz band, surpassing the previous milestone of 240 Gbps, and accelerating the characterization of 6G sub-THz components.

Read more…

16 {{ "2025-06-16T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-16T00:00:00+00:00" | date "longDate" }}

Rutronik News

Toshiba Launches Compact, High-Speed Photo Relays for Enhanced Semiconductor Testing Efficiency

Rutronik presents Toshiba’s TLP3414S and TLP3431S photo relays with faster switching, low resistance, and compact design for high-performance semiconductor test systems.

Read more…

16 {{ "2025-06-16T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-16T00:00:00+00:00" | date "longDate" }}

Trelleborg News

Trelleborg Debuts Ultra-Pure Sealing Solutions for Semiconductor Manufacturing at Silicon Saxony Day

Trelleborg unveils Isolast PureFab seals and Seal-Glide tech at Silicon Saxony Day (June 17, Dresden), emphasizing precision solutions for extreme semiconductor fab conditions.

Read more…

16 {{ "2025-06-16T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-06-16T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric Verifies Compact GaN Amplifier for 5G-Advanced

World’s first 7GHz GaN power amplifier module achieves top efficiency and compact design for next-gen 5G base stations.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Mitsubishi Electric Automation, Inc. Welcomes New Managing Director for Mexico and Latin America, Edgar Romero

Edgar Romero will serve as Managing Director for Mexico and Latin America at Mitsubishi Electric Automation to improve the company's performance and profitability in Mexico and Latin America.

STMicroelectronics Unveils Human Presence Detection to Enhance PC User Experience

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

Applied Materials and CEA-Leti Expand Joint Lab to Pioneer Energy-Efficient AI Chips

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

Broadcom Unveils VMware Cloud Foundation 9.0

VCF 9.0 combines public cloud agility with private cloud control, boosting innovation, cost-efficiency, and security.

Anritsu Launches Compact MG36021A Synthesiser

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

ROHM Builds the Future of AI with Optimized Solutions for NVIDIA 800V Architecture

ROHM supports NVIDIA’s 800V HVDC AI data centers with advanced SiC and GaN power semiconductors, enabling efficient, scalable, and sustainable high-voltage power infrastructure.

Keysight, NTT Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G

Achieved 280 Gbps in the 300 GHz band, surpassing the previous milestone of 240 Gbps, and accelerating the characterization of 6G sub-THz components.

Toshiba Launches Compact, High-Speed Photo Relays for Enhanced Semiconductor Testing Efficiency

Rutronik presents Toshiba’s TLP3414S and TLP3431S photo relays with faster switching, low resistance, and compact design for high-performance semiconductor test systems.

Trelleborg Debuts Ultra-Pure Sealing Solutions for Semiconductor Manufacturing at Silicon Saxony Day

Trelleborg unveils Isolast PureFab seals and Seal-Glide tech at Silicon Saxony Day (June 17, Dresden), emphasizing precision solutions for extreme semiconductor fab conditions.

Mitsubishi Electric Verifies Compact GaN Amplifier for 5G-Advanced

World’s first 7GHz GaN power amplifier module achieves top efficiency and compact design for next-gen 5G base stations.

International

Technical Articles

Edgar Romero will serve as Managing Director for Mexico and Latin America at Mitsubishi Electric Automation to improve the company's performance and profitability in Mexico and Latin America.

New AI-driven ToF solution reduces daily power use by over 20% while enhancing user security, privacy, and overall PC experience.

Applied Materials and CEA-Leti’s expanded Grenoble lab will drive ICAPS semiconductor innovation for AI data centers and IoT/automotive markets.

VCF 9.0 combines public cloud agility with private cloud control, boosting innovation, cost-efficiency, and security.

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.

ROHM supports NVIDIA’s 800V HVDC AI data centers with advanced SiC and GaN power semiconductors, enabling efficient, scalable, and sustainable high-voltage power infrastructure.

Achieved 280 Gbps in the 300 GHz band, surpassing the previous milestone of 240 Gbps, and accelerating the characterization of 6G sub-THz components.

Rutronik presents Toshiba’s TLP3414S and TLP3431S photo relays with faster switching, low resistance, and compact design for high-performance semiconductor test systems.

Trelleborg unveils Isolast PureFab seals and Seal-Glide tech at Silicon Saxony Day (June 17, Dresden), emphasizing precision solutions for extreme semiconductor fab conditions.

World’s first 7GHz GaN power amplifier module achieves top efficiency and compact design for next-gen 5G base stations.

International

The EcoSyn Lite MG36021A offers 10 MHz–20 GHz range, low phase noise, fast switching, compact size, and easy automation.