High-Speed FPGA Connectivity for Edge Embedded Systems

At the electronica trade show held in Munich, Germany, from November 10 to November 13, 2026, advanced embedded computing systems and high-speed interconnect platforms were presented at the edge lab LIVE! program. The technical exhibition focused on modular FPGA development kits and high-bandwidth board-to-board connectivity solutions designed for edge artificial intelligence and Internet of Things applications.

Core Technology and System Architecture
The presented technology centers on the Adiuvo Engineering Explorer Board, which integrates multiple Samtec high-speed interconnect products to support FPGA-based evaluation and signal transmission. The board architecture features four Pmod interface locations utilizing Samtec TSW and SSW series terminal and socket strips, alongside two High-Speed Input/Output transceivers implemented via Samtec QSH and QSE series board-to-board connectors. Power delivery is managed through a USB-C interface. Additional hardware demonstrations include Samtec COM-HPC standard products utilizing 400-pin arrays based on AcceleRate HP High-Performance technology to support PCIe 5.0 at 32 Gbps, PCIe 6.0 at 64 Gbps PAM4, 25 GbE channels, 40 Gbps USB4, and 80 Gbps DisplayPort signals. Furthermore, Open Harmonized FPGA Modules standard products incorporate connector-based System-on-Modules supporting data rates up to 112 Gbps PAM4 for high-speed scalability.

Deployment and Implementation
Implementation of the FPGA evaluation platform proceeds through modular subsystem assembly, connecting mezzanine expansion cards directly to carrier boards via controlled-impedance mating connectors. Interoperability between processing elements and peripheral interfaces relies on standardized pinout definitions defined within the COM-HPC and oHFM specifications, ensuring mechanical stability and signal integrity across high-frequency data links.

Industry Applications
Target industries encompass embedded systems design, industrial automation, edge computing, and telecommunications equipment manufacturing. Concrete technical use cases include high-speed data acquisition, real-time sensor processing for artificial intelligence algorithms, and modular hardware prototyping for industrial control loops. These deployments achieve reduced signal degradation, reliable multi-vendor module interchangeability, and high-density board stacking in space-constrained enclosures.

Operational Impact and Performance Metrics
The utilization of precise board-to-board geometries and low-loss dielectric connector structures minimizes insertion loss and crosstalk at data rates exceeding 100 Gbps. Standardized mechanical footprints reduce layout complexity for hardware engineers, accelerating development cycles for high-performance computing boards.

Technical leadership perspectives emphasize the architectural rationale. System design priorities centered on deterministic high-speed signal integrity and standards-based modularity to simplify multi-vendor integration tasks across complex embedded computing architectures. Matt Burns noted that the technology collaboration brings essential connectivity solutions to the Explorer Board, allowing engineers to efficiently evaluate and develop with the latest FPGAs and interconnect solutions. Brandon Lewis stated that proper interconnect selection remains critical for the thriving embedded systems industry.

Edited by Sucithra Mani, Induportals editor – adapted by AI

www.samtec.com