Designing Smarter Industrial Connections at electronica

The exhibited systems utilize modular board-to-board and board-to-cable connection architectures compliant with DIN 41612 standards, alongside 3D MID technology that integrates complex conductive paths directly into three-dimensional plastic structures. The newly introduced Han Miniature Power Connector PCB versions combine high current-carrying capacity with reduced mass, transmitting power and signals through a single mating face. Furthermore, Single Pair Ethernet architectures enable transparent data transmission from field sensors to upper-layer networks over a single pair of copper wires, reducing physical harness volume and maintaining signal integrity across high-vibration operational parameters.

Industry Applications
The connectivity solutions are engineered for industrial automation, robotics, semiconductor manufacturing, and autonomous unmanned aerial vehicles. Concrete technical use cases include power and signal distribution within humanoid robotic joints, high-density backplane interfacing for semiconductor processing equipment, and field-level Ethernet connectivity in smart building systems. Operational benefits include minimized design debt during prototyping, reduced thermal and mechanical stress on compact devices, and compliance with Design for Excellence parameters.

Deployment and Implementation
Implementation involves configuring modular connectors and digital prototyping files via online product configurators, allowing engineers to order custom assemblies from a quantity of one. Integration into brownfield and greenfield electronics relies on standardized footprint designs and board-level mounting mechanisms that eliminate the need for extensive PCB redesigns. Technical support and collaborative validation by HARTING engineering teams ensure backward compatibility and reliable mechanical mating across demanding industrial environments.

Operational Impact and Performance Metrics
The integration of miniaturized power connectors and digital design tools eliminates mechanical interface bottlenecks, resulting in a quantifiable reduction in prototyping iterations and development timelines. By consolidating power and signal transmission into a single mating face and utilizing Single Pair Ethernet for physical layer cabling, the systems achieve a significant reduction in total harness weight and spatial footprint while ensuring stable electrical contact resistance under continuous mechanical cycling.

"AI is moving from the data centre into machines, robots and drones. Wherever intelligence is added, the demands on the transmission of power, data and signals increase, and many of these requirements are determined early in development," said Kurt Robert Hippler, VP Global Business Area Device at the HARTING Technology Group.

Edited by Sucithra Mani, Induportals editor – adapted by AI

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