Trelleborg Debuts Ultra-Pure Sealing Solutions for Semiconductor Manufacturing at Silicon Saxony Day
Trelleborg unveils Isolast PureFab seals and Seal-Glide tech at Silicon Saxony Day (June 17, Dresden), emphasizing precision solutions for extreme semiconductor fab conditions.
www.trelleborg.com
For the first time, Trelleborg Sealing Solutions showcases its solutions for the semiconductor industry at Silicon Saxony Day, on June 17, 2025, at Dresden Airport, Germany.
Internationally known as an exclusive hotspot event for the European semiconductor industry, it brings together leading players, industry association members and partners within the semiconductor sector. Trelleborg demonstrates its expertise as a sealing specialist by presenting technologies tailored to extreme fabrication and sub-fab environments, ensuring maximum process reliability, purity and efficiency in semiconductor manufacturing.
By participating in this networking and exhibition event, Trelleborg underscores its commitment to its ‘Local for Local’ strategy, showcasing how its global capabilities combined with local in-country or in-region production benefits European customers.
Highlights at the show include precision-engineered O-Rings and custom-molded parts where precision, purity and durability are required for customer-specific applications. Trelleborg also demonstrates innovative rubber-to-metal and rubber-to-plastic composite seals for ultra-critical applications, as well as chemical mechanical planarization (CMP) membranes and wafer seals for electrochemical deposition (ECD) processes on-site.
"Silicon Saxony Day is a fantastic platform for us as members of the Silicon Saxony association and network to demonstrate our commitment to the international semiconductor industry from our European base,” says Ritchie Greven, Segment Manager Semicon Europe, who is part of the Trelleborg team at the event.
“Through our 'Local for Local' strategy, we showcase how Trelleborg is a global player but also a reliable local partner that understands and meets the semiconductor industry's extreme requirements."
Trelleborg will also spotlight its Isolast® PureFab™ FFKM materials, renowned for their stability in extreme temperature ranges, exceptionally low particle release and high purity, making them ideal for demanding processes such as etching and deposition. The sealing experts will also highlight the innovative surface treatment technology, Seal-Glide®, which reduces friction and stick-slip behavior in elastomer seals, enhancing operational efficiency and decreasing production downtime.
www.trelleborg.com
