High-frequency crystal oscillators from Hong Kong X'tals (HKC) ensure high stability and low noise in the system design. This is possible thanks to a differential output and low-phase jitter.
ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization.
Infineon Technologies AG and Fingerprint Cards AB (STO: FING B, Fingerprints) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announces the final remaining 2022 episode of its award-winning Empowering Innovation Together program.
Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD’s Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk’s FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.
Through a new multiyear agreement, Ansys’ comprehensive simulation portfolio will empower Murata to develop cutting-edge, sustainable wireless connectivity products.
The SCALEXIO Ethernet boards provide additional Ethernet interfaces to the SCALEXIO Processing Unit, the SCALEXIO LabBox or the SCALEXIO AutoBox. Boards that offer native BroadR-Reach support and an integrated Ethernet switch are available for both platforms, and they can be configured via modules.
Infineon Technologies AG recently added EasyPACK 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters.
Electric vehicles contain many electronic components that emit radio-frequency interference which may have a negative impact on the vehicle performance and driving experience. To ease and speed up the development process, AVL and Rohde & Schwarz, two of the world’s leading providers of automotive test systems, present an innovative solution for automated electromagnetic compatibility (EMC) data analysis of an electric drivetrain under real driving conditions.