TDK Corporation expanded the EPCOS ERU33 high-current chokes with the even higher-current ERU33M using a new core material, that exhibits a softer saturation characteristic than the core material used previously.
Opportunity to see innovations in 3D-AOI that increase resolution, throughput, and accuracy, the latest in solder-paste inspection (SPI), and new software tools in YSUP production support package.
Innodisk launched its cutting-edge Compute Express Link (CXL) Memory Module, which is designed to meet the rapid growth demands of AI servers and cloud data centers.
Innodisk, a leading global AI solution provider, announced its cooperation with Advantech, a global leader in AIoT and Edge Computing. This collaboration leverages Innodisk's customizable MIPI camera modules and Advantech's Intel x86-based AFE-R360 solution to enhance AI-powered object detection and recognition capabilities, expanding visual applications for Autonomous Mobile Robots (AMRs) in smart factories, warehouses, and retail environments.