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Mantracourt News
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'21
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Molex News
Molex Offers Mobile Device Manufacturers Greater Design
Freedom with New RF mmWave 5G25 Connector Series. Molex, a global electronics leader and connectivity innovator, today introduced the Molex Flex-to-Board RF mmWave Connector 5G25 series to meet demanding 5G mmWave applications requiring stringent signal integrity at higher frequencies up to 25 GHz.
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'21
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Siga transformers News
ETAL and SIGA bring a magnetic presence to the Engineering Design Show
Current transformers and high voltage / high power transformers to be exhibited alongside full range of magnetic component solutions.
29
'21
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Renesas News
Renesas Launches RX140 MCUs with 2x Performance and Over 30 Percent Better Power Efficiency for Home and Industrial Applications
New Ultra-Low Power RX140 MCUs Realize Improved Noise Tolerance and Sensing Accuracy Through Advanced Touch Sensing.
29
'21
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Anritsu News
Anritsu in collaboration with Qualcomm verifies industry first Release 16 Minimization of Drive Test for 5G New Radio Standalone mode
Anritsu Corporation is pleased to announce that the first Release 16 Minimization of Drive Test (MDT) Protocol Conformance Test for 5G New Radio (NR) Standalone (SA) has been verified on the 5G NR Mobile Device Test Platform ME7834NR powered by the Snapdragon® X65 5G Modem-RF System, the world’s first Release 16 modem-RF system.
29
'21
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ST News
STMicroelectronics Launches Highly Integrated Intelligent High-Side Drivers for Automotive Applications
The VN9D30Q100F and VN9D5D20FN from STMicroelectronics introduce a new generation of automotive intelligent switches, the first in the market with digital current sensing among the fully digital on-chip diagnostic features.
29
'21
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Leica Geosystems News
Hexagon announces Leica ContentMapper – new airborne imaging sensor for efficient large-scale content collection
Hexagon’s Geosystems division announced today the introduction of the Leica ContentMapper, an innovative and highly efficient airborne imaging sensor for large-scale geospatial mapping projects. With a 40,000 pixels swath width, this latest generation camera provides the highest performance for content programs, capturing high resolution imagery at unprecedented rates.
29
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TDK News
EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
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ST News
STMicroelectronics’ STM32 Ecosystem Extensions Kick-Start Development with STM32U5 Extreme Low-Power Microcontrollers
STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development with the latest STM32U5 microcontrollers (MCUs), which are now ready for mass-market applications with stock at authorized distributors.
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Sigmatek News
