Accelerating technical innovation in the automotive industry to achieve a sustainable society. The global semiconductor manufacturer ROHM, together with Geely Automobile Group Co., Ltd., a leading Chinese automobile manufacturer, have entered into a strategic partnership to develop advanced technologies in the automotive field.
Omron Electronics Components Europe has announced two new fully sealed, miniature micro switches offering an exceptionally compact and flexible solution for applications exposed to water spray or high levels of dust.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.
Yokohama National University, a national university corporation (Yokohama-city, Kanagawa pref. President: Izuru Umehara, hereinafter “YNU”) and TDK Corporation (Tokyo, President: Shigenao Ishiguro, hereinafter “TDK”) have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor*.
Datalogic, a global leader in the automatic data capture and factory automation markets, is pleased to announce its participation at PACK EXPO 2021 in Las Vegas, with an extensive booth displaying traceability solutions for every application.
Educational services also provided for learning the basics and applications of quantum computers. NEC Corporation (NEC; TSE: 6701) announced the launch of the "NEC Vector Annealing Service," a quantum-inspired simulated annealing service that uses a vector supercomputer, as well as the launch of educational services that enable participants to learn about quantum computers and how to use simulated annealing machines. NEC will start offering both services in November 2021.