10
'26
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Rutronik News
10
'26
Written on
BitFlow News
Frame Grabber Enables Space Radiation Camera Testing
BitFlow hardware supports NASA’s evaluation of infrared imaging systems under high-energy ion exposure, validating data acquisition reliability for space instrumentation.
10
'26
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Intel News
Intel and Google expand AI infrastructure collaboration
Multi-year partnership focuses on Xeon CPUs and custom IPUs to improve performance, efficiency, and scalability in heterogeneous AI and cloud environments.
10
'26
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Siemens News
Siemens accelerates AI chip verification with NVIDIA
FPGA-based prototyping enables trillion-cycle pre-silicon validation, addressing scalability challenges in complex AI/ML system-on-chip development.
08
'26
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iBASE News
AI-Optimized Edge Computing Motherboard Platform
IBASE Technology introduces MBB1002 motherboard to support scalable edge AI and data-intensive workloads using AMD EPYC Embedded processors.
08
'26
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Emerson
Emerson launches configurable Polaris welding platform
Emerson introduces scalable ultrasonic system enabling flexible, efficient, and high-quality joining across diverse manufacturing applications.
08
'26
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TDK News
TDK improves audio lines with ultra-small noise filters
Compact filters reduce high-frequency interference above 5 GHz while preserving audio quality in smartphones and wearable devices.
08
'26
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MURATA News
High-Capacitance MLCCs Enable Compact Automotive Electronics
Murata Manufacturing expands its MLCC portfolio with high-capacitance components designed to support ADAS systems and improve PCB space efficiency in automotive applications.
07
'26
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Molex News
Molex Completes Acquisition of Smiths Interconnect
Molex acquires Smiths Interconnect to expand capabilities across aerospace, medical, and semiconductor markets.
07
'26
Written on
Northrop Grumman News
