18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

TDK News

MOSFET ORing Modules Improve Power Redundancy Efficiency

TDK Corporation introduces compact MOSFET-based ORing modules designed to enhance power redundancy and reduce losses in industrial and communication systems.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Synopsis News

Electronics digital twins support software-defined system development

Synopsys presents a cloud-enabled development platform for virtual validation of automotive and physical AI systems within complex semiconductor and software ecosystems.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

innodisk

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Validates 800GE Ultra Ethernet for AI Clusters

Interoperability testing of LLR and CBFC link layer mechanisms ensures predictable latency and congestion control in hyperscale AI networks.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

ZF News

ZF unveils scalable I/O interface chip architecture for next-generation ADAS and automated driving

New chiplet-ready design, combined with SiliconAuto’s XMotiv M3 controller, enables flexible, energy-efficient and upgradeable automotive high-performance computing.

Read more…

18 {{ "2026-03-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-18T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

56G Connector Targets High-Speed Modular Systems

TE Connectivity introduces MezzaWave interconnects to support high-density data transmission and signal integrity across edge AI, data centers, and industrial automation.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

Teledyne SP Devices Launches High-Speed Disk Streaming with ADQ35

Teledyne SP Devices combines ADQ3 boards and libads to enable sustained multi-tens-of-GB/s disk streaming for long-duration data capture.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

ST Integrates Robotics Hardware with NVIDIA AI Platforms

The collaboration between the two companies aims to combine sensors, microcontrollers and simulation models in order to streamline the development of robotic systems.

Read more…

17 {{ "2026-03-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-17T00:00:00+00:00" | date "longDate" }}

Ulefone

RugOne by Ulefone Introduces Modular Rugged Smartphone with Detachable Camera

Xsnap 7 Pro combines modular expansion, AI imaging, and extreme durability for industrial and field applications requiring multifunctional mobile devices.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

MOSFET ORing Modules Improve Power Redundancy Efficiency

TDK Corporation introduces compact MOSFET-based ORing modules designed to enhance power redundancy and reduce losses in industrial and communication systems.

Electronics digital twins support software-defined system development

Synopsys presents a cloud-enabled development platform for virtual validation of automotive and physical AI systems within complex semiconductor and software ecosystems.

Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

Solutions presented by Innodisk at NVIDIA GTC 2026

At NVIDIA GTC 2026, alongside subsidiary Aetina, Innodisk is showcasing the seamless integration of NVIDIA AI architectures into scalable, deployable edge AI applications.

Keysight Validates 800GE Ultra Ethernet for AI Clusters

Interoperability testing of LLR and CBFC link layer mechanisms ensures predictable latency and congestion control in hyperscale AI networks.

ZF unveils scalable I/O interface chip architecture for next-generation ADAS and automated driving

New chiplet-ready design, combined with SiliconAuto’s XMotiv M3 controller, enables flexible, energy-efficient and upgradeable automotive high-performance computing.

56G Connector Targets High-Speed Modular Systems

TE Connectivity introduces MezzaWave interconnects to support high-density data transmission and signal integrity across edge AI, data centers, and industrial automation.

Teledyne SP Devices Launches High-Speed Disk Streaming with ADQ35

Teledyne SP Devices combines ADQ3 boards and libads to enable sustained multi-tens-of-GB/s disk streaming for long-duration data capture.

ST Integrates Robotics Hardware with NVIDIA AI Platforms

The collaboration between the two companies aims to combine sensors, microcontrollers and simulation models in order to streamline the development of robotic systems.

RugOne by Ulefone Introduces Modular Rugged Smartphone with Detachable Camera

Xsnap 7 Pro combines modular expansion, AI imaging, and extreme durability for industrial and field applications requiring multifunctional mobile devices.

International