10
'26
Written on
Intel News
10
'26
Written on
Siemens News
Siemens accelerates AI chip verification with NVIDIA
FPGA-based prototyping enables trillion-cycle pre-silicon validation, addressing scalability challenges in complex AI/ML system-on-chip development.
08
'26
Written on
iBASE News
AI-Optimized Edge Computing Motherboard Platform
IBASE Technology introduces MBB1002 motherboard to support scalable edge AI and data-intensive workloads using AMD EPYC Embedded processors.
08
'26
Written on
Emerson
Emerson launches configurable Polaris welding platform
Emerson introduces scalable ultrasonic system enabling flexible, efficient, and high-quality joining across diverse manufacturing applications.
08
'26
Written on
TDK News
TDK improves audio lines with ultra-small noise filters
Compact filters reduce high-frequency interference above 5 GHz while preserving audio quality in smartphones and wearable devices.
08
'26
Written on
MURATA News
High-Capacitance MLCCs Enable Compact Automotive Electronics
Murata Manufacturing expands its MLCC portfolio with high-capacitance components designed to support ADAS systems and improve PCB space efficiency in automotive applications.
07
'26
Written on
Molex News
Molex Completes Acquisition of Smiths Interconnect
Molex acquires Smiths Interconnect to expand capabilities across aerospace, medical, and semiconductor markets.
07
'26
Written on
Northrop Grumman News
Synthetic diamonds to improve thermal management
Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management.
07
'26
Written on
Diodes Incorporated News
MOSFETs Improve Efficiency in 48V Automotive Systems
Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.
07
'26
Written on
AMD News
