05 {{ "2026-05-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-05T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

GaN flyback converters target compact 100W power designs

STMicroelectronics integrates GaN switching, control, and drive functions to improve efficiency, thermal performance, and power density in consumer and industrial power supplies.

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05 {{ "2026-05-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-05T00:00:00+00:00" | date "longDate" }}

Kyocera News

Multilayer varistors target 48V automotive power systems

KYOCERA AVX expands high-temperature transient protection components to support growing 48V vehicle architectures, addressing electrical stress, space constraints, and reliability in automotive electronics.

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04 {{ "2026-05-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-04T00:00:00+00:00" | date "longDate" }}

CEA Leti News

Semiconductor Innovation Summit Advances AI Manufacturing Technologies

CEA-Leti hosts LID World Summit 2026 to showcase semiconductor technologies enabling scalable AI factories and cross-industry applications.

Read more…

01 {{ "2026-05-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-01T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Compact 3-axis vibration sensing for condition monitoring

STMicroelectronics introduces a wide-bandwidth MEMS sensor to improve accuracy and integration in industrial and automotive condition monitoring systems.

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01 {{ "2026-05-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-01T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Expands Wi-Fi 8 and 10G PON Portfolio

Broadcom introduces optimized Wi-Fi 8 chips and a 10G PON SoC to facilitate large-scale migration to high-speed fiber-based connectivity.

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29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Ultralow-Power Vision Sensors for Edge AI Devices

STMicroelectronics introduces compact global-shutter image sensors enabling always-on embedded vision for wearables, AR/VR systems, and energy-constrained smart devices.

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29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }}

TDK News

Integrated DC-DC converters simplify industrial power design

TDK Corporation introduces encapsulated converter modules to reduce design complexity and footprint in industrial power architectures.

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29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip introduces post-quantum root of trust controllers

New controllers support post-quantum cryptography and secure boot for data center, telecom and infrastructure platforms.

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29 {{ "2026-04-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-29T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM NFC Chipset Enables Wireless Charging in Wearables

Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics.

Read more…

28 {{ "2026-04-28T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-28T00:00:00+00:00" | date "longDate" }}

Kyocera News

Multilayer Ceramic Substrate for AI Semiconductor Packaging

Kyocera Corporation introduces a rigid ceramic core substrate to address warpage and wiring density limits in advanced AI and ASIC semiconductor packaging.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

GaN flyback converters target compact 100W power designs

STMicroelectronics integrates GaN switching, control, and drive functions to improve efficiency, thermal performance, and power density in consumer and industrial power supplies.

Multilayer varistors target 48V automotive power systems

KYOCERA AVX expands high-temperature transient protection components to support growing 48V vehicle architectures, addressing electrical stress, space constraints, and reliability in automotive electronics.

Semiconductor Innovation Summit Advances AI Manufacturing Technologies

CEA-Leti hosts LID World Summit 2026 to showcase semiconductor technologies enabling scalable AI factories and cross-industry applications.

Compact 3-axis vibration sensing for condition monitoring

STMicroelectronics introduces a wide-bandwidth MEMS sensor to improve accuracy and integration in industrial and automotive condition monitoring systems.

Broadcom Expands Wi-Fi 8 and 10G PON Portfolio

Broadcom introduces optimized Wi-Fi 8 chips and a 10G PON SoC to facilitate large-scale migration to high-speed fiber-based connectivity.

Ultralow-Power Vision Sensors for Edge AI Devices

STMicroelectronics introduces compact global-shutter image sensors enabling always-on embedded vision for wearables, AR/VR systems, and energy-constrained smart devices.

Integrated DC-DC converters simplify industrial power design

TDK Corporation introduces encapsulated converter modules to reduce design complexity and footprint in industrial power architectures.

Microchip introduces post-quantum root of trust controllers

New controllers support post-quantum cryptography and secure boot for data center, telecom and infrastructure platforms.

ROHM NFC Chipset Enables Wireless Charging in Wearables

Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics.

Multilayer Ceramic Substrate for AI Semiconductor Packaging

Kyocera Corporation introduces a rigid ceramic core substrate to address warpage and wiring density limits in advanced AI and ASIC semiconductor packaging.

International