06
'26
Written on
CEA Leti News
03
'26
Written on
STMicroelectronics News
GaN Gate Drivers for High-Speed Power Conversion
STMicroelectronics introduces GaN drivers enabling efficient motion control and compact power conversion system design.
02
'26
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Nanomade News
Transparent force and touch sensing film for HMIs
A joint Nanomade–PolyIC development combines printed electronics and force detection to support transparent user interfaces in automotive, medical and consumer devices.
02
'26
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Omnivision News
Image signal processor integration for arthroscopy imaging
Omnivision ISP integration targets stable colour reproduction and low-latency processing in endoscopic visualization platforms used in minimally invasive surgical imaging workflows.
02
'26
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Power Integrations News
Flyback ICs Extend Power Range to 440 W
Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.
01
'26
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Tria Technologies News
Multi-OS Support for ARM Embedded Systems
Tria Technologies extends Qualcomm-based platforms with Yocto Linux, Windows 11 IoT, and Android to increase flexibility in embedded system design.
01
'26
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Melexis News
Code-Free Three-Phase Motor Driver Simplifies BLDC Design
Melexis introduces MLX80339 to enable fast deployment of efficient, low-noise fan systems without embedded software development.
01
'26
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Rohm Semiconductors News
ROHM expands op amp portfolio for precision electronics
New CMOS op amps target automotive, industrial and consumer applications requiring accurate signal amplification and low-noise analog design.
01
'26
Written on
Congatec News
congatec enables rugged AI computing with Intel Core Ultra COMs
New Computer-on-Modules operate from -40 °C to +85 °C, delivering up to 180 TOPS for edge AI in industrial and mission-critical environments.
31
'26
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Sivers Semiconductors News
