Intel has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.
New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.
New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.
Amphenol’s SOSA-aligned connector, distributed by Powell Electronics, supports high-speed embedded computing with increased density and signal integrity for defense platforms.
TDK introduces PFE1500FB power modules to support industrial and building automation systems with wide input range, high efficiency, and remote monitoring capabilities.