17
'26
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STMicroelectronics News
17
'26
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Ulefone
RugOne by Ulefone Introduces Modular Rugged Smartphone with Detachable Camera
Xsnap 7 Pro combines modular expansion, AI imaging, and extreme durability for industrial and field applications requiring multifunctional mobile devices.
17
'26
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AMD News
AMD Advances Rack-Scale AI Infrastructure with Celestica
Open standards-based platform integrates high-speed networking and GPU interconnects to support scalable AI clusters across cloud, enterprise, and research environments.
16
'26
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Vecow News
Edge IPC Portfolio Adopts Intel Core 200S Processors
Vecow integrates Intel Core 200S Series processors with P-core-only architecture into its rugged edge computing platforms.
13
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Avalue News
Industrial Motherboard Platform for AI and Edge Expansion
Avalue Technology introduces an ATX motherboard supporting Intel Core processors and PCIe Gen5 expansion for scalable AI inference, industrial computing, and edge data processing.
13
'26
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Anritsu News
Qualitas Uses Anritsu VNA for Interconnect Testing
Anritsu ShockLine analyzer strengthens signal integrity verification for high-speed PHY interface development.
12
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MIkroe News
Modular MCU Board Accelerates Embedded Prototyping
MIKROE introduces a Renesas-based development board for rapid prototyping using modular sensor and communication interfaces for embedded systems and industrial IoT applications.
12
'26
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Samsung News
Multi-Die Design Frameworks for Advanced Semiconductor Systems
Samsung Foundry and Synopsys collaborate to develop integrated design flows enabling multi-die semiconductor architectures for AI, HPC, and advanced computing applications.
12
'26
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Aetina
Aetina showcases 3D vision and Generative AI at GTC 2026
Aetina presents Jetson Thor platforms and MGX edge servers enabling robotic perception and enterprise AI decision-making at the edge.
12
'26
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Toshiba News
