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Fraunhofer News
05
'26
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OMRON News
1500V Relays for Pre-Charge Circuits in EV Charging
OMRON introduces a compact PCB-mount relay designed for high-voltage pre-charge switching in energy storage systems and fast-charging infrastructure.
05
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NXP News
NXP Introduces Bluetooth Ranging Vehicle Access System
Using the KW47 automotive MCU and Bluetooth Channel Sounding, the system enables precise distance measurement and secure “phone as a key” functionality for smart vehicles.
05
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Siemens News
Siemens Launches AI Cybersecurity Solution for Industrial 5G
Developed with Palo Alto Networks, the solution combines private 5G infrastructure with AI-driven firewall technology to secure industrial wireless networks without affecting performance.
05
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TDK News
TDK Introduces ThermoFuse Varistors for High-Surge Protection
The MT40 series combines a compact design with integrated thermal disconnection to protect industrial and energy systems from surge currents up to 50 kA.
05
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Micron News
Micron Launches World’s First High Capacity 256GB LPDRAM SOCAMM2 Module
The industry's first 32Gb LPDDR5X die enables 1.33x more capacity, 2.3x faster LLM inference, and 3x better efficiency while significantly reducing power and footprint.
05
'26
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Broadcom News
Broadcom Ships Industry First 2nm Custom Compute SoC for AI
Broadcom launches its 3.5D XDSiP platform featuring 2nm technology and 3D-IC integration, enabling Fujitsu and other partners to scale high-performance, low-power XPUs for massive AI.
04
'26
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STMicroelectronics News
Edge AI Sensors Support Next-Generation Wearable Platforms
STMicroelectronics and Qualcomm Technologies integrate motion sensing and secure NFC technologies into the Snapdragon Wear Elite platform to enable low-power AI processing and contactless services in wearable devices.
04
'26
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Hitachi News
Hitachi Energy and Pakal Technologies Partner to Revolutionize Power Semiconductors
Hitachi Energy will integrate IGTO technology into high-voltage modules, reducing energy losses by 30 percent to enhance efficiency across renewables, AI, and rail.
04
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Aetina
