08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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innodisk

Innodisk Unveils the New Computing Series with the First EXMP-Q911 COM-HPC Mini Module

The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.

Read more…

07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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SK Hynix News

SK hynix Unveils Next-Generation AI Memory at CES 2026

From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.

Read more…

07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-07T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Snapdragon X2 Plus Platform for Windows PCs

Qualcomm expands AI-centric PC silicon with multi-day battery life and balanced performance for professionals and creators.

Read more…

07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-07T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Bluetooth Beacons for Cold Chain Monitoring

Silicon Labs and MOKOSMART advance temperature tracking for perishable logistics with real-time BLE sensors.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-07T00:00:00+00:00" | date "longDate" }}

RealMan Robotics

RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026

A system-level platform spanning humanoid robotic arms, integrated joint modules, global remote operations, and open-sourced real-world data.

Read more…

07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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Micron News

Micron Launches World's First Gen5 G9 QLC SSD for Client Computing

The new client SSD combines Gen5 bandwidth, high-density QLC NAND and low-power design to enable compact, AI-capable laptops with higher storage capacity and efficiency.

Read more…

06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-06T00:00:00+00:00" | date "longDate" }}

Kontron News

3.5-inch single board computer for industrial edge AI

Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.

Read more…

06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-06T00:00:00+00:00" | date "longDate" }}

Vecow News

Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3

The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.

Read more…

06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-06T00:00:00+00:00" | date "longDate" }}

Contrinex News

Contrinex Expands Digital Distance Sensors for Flexible Automation

Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.

Read more…

06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Mediatek News

MediaTek Advances Wi-Fi 8 Reliability for High-Density Connected Devices

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Innodisk Unveils the New Computing Series with the First EXMP-Q911 COM-HPC Mini Module

The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.

SK hynix Unveils Next-Generation AI Memory at CES 2026

From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.

Snapdragon X2 Plus Platform for Windows PCs

Qualcomm expands AI-centric PC silicon with multi-day battery life and balanced performance for professionals and creators.

Bluetooth Beacons for Cold Chain Monitoring

Silicon Labs and MOKOSMART advance temperature tracking for perishable logistics with real-time BLE sensors.

RealMan Robotics Showcases Embodied Intelligence Infrastructure at CES 2026

A system-level platform spanning humanoid robotic arms, integrated joint modules, global remote operations, and open-sourced real-world data.

Micron Launches World's First Gen5 G9 QLC SSD for Client Computing

The new client SSD combines Gen5 bandwidth, high-density QLC NAND and low-power design to enable compact, AI-capable laptops with higher storage capacity and efficiency.

3.5-inch single board computer for industrial edge AI

Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.

Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3

The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.

Contrinex Expands Digital Distance Sensors for Flexible Automation

Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.

MediaTek Advances Wi-Fi 8 Reliability for High-Density Connected Devices

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

International