21
'26
Written on
NXP News
21
'26
Written on
ATP Electronics News
ATP Electronics launches world’s smallest 6.7 mm e.MMC for next-generation smart wearables
Ultra-compact e.MMC delivers major size reduction, high power efficiency, and robust performance for space-constrained designs.
21
'26
Written on
TDK News
TDK expands its high-temperature MEMS accelerometer portfolio for energy market applications
The new AXO315T1 supports high-temperature downhole sensing, offering digital inclination measurement for MWD tools operating reliably under extreme thermal and vibration conditions.
21
'26
Written on
ASMPT News
ASMPT introduces the SIPLACE V platform, redefining high-performance SMT placement
Up to 30% higher output with maximum flexibility, compact footprint, and long-term investment protection.
20
'26
Written on
TDK News
High-Temperature DC Link Capacitors for Power Electronics
New ModCap UHP series from TDK Corporation enables continuous high-current performance in demanding converter environments.
20
'26
Written on
Infineon News
Infineon targets secure USB 2.0 peripheral controllers
Designed for USB Hi-Speed peripherals, the new controller adds security hardware, DMA support, and large on-chip buffering for data-intensive devices.
19
'26
Written on
TDK News
Automotive ESD Protection Enables High-Density PCB Design
Tier-1 automotive suppliers adopt compact chip varistors to protect communication lines while reducing PCB space and cost.
19
'26
Written on
Keysight technologies News
Keysight adds AI modeling toolkit for faster PDK development
The new software module automates parameter extraction for compact device models, supporting DTCO workflows for advanced-node, RF and power semiconductors.
19
'26
Written on
Keysight technologies News
AI-assisted device modeling accelerates PDK development
Keysight introduces a machine-learning toolkit to shorten semiconductor model extraction and support faster design-technology co-optimization.
16
'26
Written on
Rutronik News
