12
'26
Written on
Altech Corporation
09
'26
Written on
Infineon News
Infineon Launches Wi-Fi 7 Tri-Radio Platform for IoT
A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.
09
'26
Written on
Microchip News
Microchip Technology Delivers Custom Firmware to Power Secure System Control in NVIDIA DGX Spark AI Platforms
The new embedded controller firmware will strengthen secure boot, power sequencing and system orchestration for compact AI supercomputing environments.
09
'26
Written on
Keysight technologies News
Live NR-NTN Validation in Band n252
Keysight Technologies and Samsung Electronics demonstrate a standards-based satellite-to-satellite NR-NTN connection at CES 2026, validating 3GPP Release 19 band n252 for direct-to-cell services.
08
'26
Written on
TDK News
TDK AIsight DSP Platform for AI Glasses
New ultralow-power vision DSP from TDK AIsight positions the company in the AI glasses and wearable computing space for context-aware sensing and eye-intent tracking.
08
'26
Written on
Southco. Inc.
Southco Develops High-Tolerance Blind Mate Mechanism for Next-Generation Liquid-Cooled Data Centers
Designed to compensate for installation deviations, vibration, and thermal expansion, the mechanism supports efficient liquid cooling deployment at scale.
08
'26
Written on
Keysight technologies News
AI Validation Framework for Safety-Critical Systems
Keysight Technologies introduces a lifecycle-based software platform to analyze, validate, and monitor AI behavior in regulated environments such as automotive and industrial systems.
08
'26
Written on
TDK News
TDK Expands High-Power AC-DC Portfolio with 4.5 kW Three-Phase Supply
The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.
08
'26
Written on
innodisk
Innodisk Unveils the New Computing Series with the First EXMP-Q911 COM-HPC Mini Module
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
07
'26
Written on
SK Hynix News
