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Technical Articles

THE FUTURE OF 5G & AI IN TELECOMMUNICATIONS

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24  '19
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MEDIAWORLD

TE Connectivity introduces AMPMODU connectors with 2 mm centerlines for board signal transfers

"We are excited to be able to grow our AMPMODU portfolio to now include a 2 mm centerline offering that provides customers with a wide variety of rugged, reliable and versatile board connectors. This extension supports the trend in our industry of board miniaturization while continuing to meet the high reliability and quality standards that our customers expect from TE”

24  '19
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Rohde & Schwarz

Rohde & Schwarz presents at productronica 2019 its portfolio for all stages of development, verification and production

The Munich based technology group Rohde & Schwarz welcomes visitors on its home turf at productronica, the world's leading trade fair for electronics development and production. At booth 375 in hall A1 of Messe München, the company will display its solutions for Industry 4.0, test and measurement solutions for production and development, and automatic production test systems. In addition, visitors can learn about the group’s electronic manufacturing services.

22  '19
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MEDIAWORLD

24 Volt ASi-5/ASi-3 PROFINET Gateway

ASi-5 offers you many advantages and new possibilities like high data bandwidth, short cycle times and easy integration of IO-Link devices.

22  '19
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MEDIAWORLD

STSPIN Modules from STMicroelectronics Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm® Ecosystem

STMicroelectronics has collaborated with MikroElektronika, an Authorized ST Partner, to create four Click boards™ that extend the advantages of STSPIN motor drivers beyond STM32-based designs to users of MikroElektronika prototyping boards, as well as other systems containing a mikroBUS™ socket.

06  '19
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Leuze

Precise control of double-depth positioning processes

The new IPS 400i from Leuze electronic is the smallest camera-based positioning sensor on the market for double-depth compartment fine positioning. It helps high-bay storage devices to quickly and easily find the right rack.

02  '19
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BALLUFF

Intelligent position measuring system for absolute linear feedback

With their BMP series Balluff has added a new intelligent displacement sensor which provides not only the absolute position signal for the stroke travel of a piston via IO-Link but also information about the sensor status and the current ambient conditions.

24  '19
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Rohde & Schwarz

Rohde & Schwarz announces first IEEE 802.3cg 10BASE-T1S compliance test solution for the automotive industry

The flexibility of Automotive Ethernet makes the simple twisted-pair network technology ideal for an ever-increasing range of in-vehicle networks. The new IEEE 10BASE-T1S standard expands the range of applications supported by Automotive Ethernet to include integrating simple devices into the network. With the first compliance test solution available for testing device-compliance to 10BASE-T1S, Rohde & Schwarz continues to lead the way as the test and measurement supplier for automotive Ethernet standards.

23  '19
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SOURIAU – SUNBANK Connection Technologies

New Backshell Product Development

The One Arm Composite Backshell developed by SUNBANK is specifically designed to offer a robust and unique performance in terms of reliability and functionality for defense, aerospace and other harsh environment applications. Our design team took into consideration different scenarios and needs for protecting cable connections from damage and providing better strain relief. The One Arm backshell family comes in 3 types of configurations, Straight, 45°, and 90°. It is designed to satisfy requirements for all sizes of MIL-DTL-38999 Series I, II, and III connectors.

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