SILINA, a deeptech startup in microelectronics, brings a real paradigm shift to the imaging industry by curving the imaging sensors. Curved sensor technology is being developed for many years but was limited to single-chip manufacturing processes, until now. SILINA has been developing a unique technology which enables to curve hundreds of imaging sensors at the same time, offering new perspectives in the design of cameras, from high volume to niche markets.
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has secured a global distribution partnership with ArkX Laboratories to offer their Advanced Far-field Voice Capture AFE module and development kit for voice-enabled IoT products.
The Global Certification Forum (GCF) has approved the first two radio ressource management (RRM) conformance test cases for 5G FR2 frequencies, implemented on the R&S TS-RRM-NR 5G RRM conformance test system from Rohde & Schwarz. The test cases have been validated in seven FR2 and LTE band combinations. With this success, Rohde & Schwarz is leading the way in validated test cases for the technically challenging FR2 mmWave frequency bands.
Murata has expanded its portfolio of positive temperature coefficient (PTC) surface-mount chip thermistors for overheat sensing by introducing the PRF03BB541NB7RL.
CEVA’s versatile and highly precise sensor fusion solution ensures an optimum customer experience in diverse consumer electronics and industrial markets.