17
'23
Written on
TDK News
10
'23
Written on
Rohm Semiconductors News
ROHM’s New ±1% Accuracy Current Sense Amplifier ICs Reduce Mounting Area by Approx. 46% Over Conventional Configurations
Wide input voltage range (-0.2V to +26V) ideal for current sensing applications operating from 12/24V power supplies.
02
'23
Written on
Rohm Semiconductors News
ROHM’s Compact Primary LDOs with Highly Stable Output Voltage Stability Ideal for Redundant Power Supplies
Maintains power for core functions even in the event of a vehicle system malfunction.
23
'23
Written on
TDK News
TDK: FAILURE MODES AND COUNTERMEASURES IN ACTUAL USE OF NTC THERMISTORS
Improper use of NTC thermistors may cause malfunctions. This article introduces the causes and countermeasures for failure modes caused by the improper use of NTC thermistors.
08
'23
Written on
Rohm Semiconductors News
ROHM’s New Compact Intelligent (Smart) Low Side Switches: Reduced Power Loss and Safer Operation Using Proprietary TDACC Circuit and Device Technology
Replaces mechanical relays and MOSFETs fulfilling functional safety requirements in the automotive and industrial equipment applications.
22
'22
Written on
MURATA News
Murata Is Seeking Partners to begin discussions for a New Transparent and Bendable Conductive Film along with the Application of New Ideas to Open up the IoT Era (Technical Explanation)
Murata Manufacturing is now developing a new material with unprecedented strong points. This new material combines transparency, flexibility, conductivity, and safety. Furthermore, it realizes high workability to be able to easily draw circuit patterns and other elements with diverse methods.
20
'22
Written on
Rohm Semiconductors News
ROHM’s New MOSFETs: Contributing to Higher Efficiency and Safer Operation with an Original Insulation Structure
Deliver class-leading power dissipation in a compact package ideal for small, thin devices.
30
'22
Written on
Rohm Semiconductors News
ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip
ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped with motors and sensors in real-time with ultra-low power consumption.
25
'22
Written on
TDK News
TDK: Flying Capacitors in PV Booster stages
One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.
17
'22
Written on
TDK News
