The new MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimize the main radio’s RF performance.
TME now offers Amphenol GEC’s PowerLok power connectors, ideal for EV, hybrid automotive, and renewable energy applications, including energy storage systems.
AMD unveils RDNA 4 GPUs and Threadripper 9000 CPUs at COMPUTEX 2025, delivering next-gen AI, gaming, and workstation performance for pros, gamers, and creators.
The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.
Würth Elektronik, in cooperation with the Institute of Electronics (IFE) at Graz University of Technology, now offers an LTspice model for its TVS diodes and ESD suppressors for ESD protection, based on real measurement data using TLP.
Proprietary 0201-size components with high-frequency capabilities, leveraging advanced structuring and sintering tech, offering finely tuned inductors in multi-layered formats, operating from -55°C to +125°C.
At COMPUTEX 2025, the companies will showcase an Enterprise AI Assistant that automates document processing, boosts efficiency 96%, and integrates ERP systems.