24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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Synopsys News

Accelerating System Design on Advanced Semiconductor Nodes

Synopsys and TSMC collaborate to deploy automated EDA workflows and unified multiphysics verification for high-performance computing components.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

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FLIR

FLIR Launches Si2a-LD and Si2a-Pro Fixed Acoustic Imaging Cameras for Continuous Asset Condition Monitoring

Teledyne FLIR completes its Si2a-Series portfolio for continuous condition monitoring.

Read more…

24 {{ "2026-09-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-24T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens & TSMC Automate Advanced Semiconductor Node Design

New agentic workflows accelerate physical verification, thermal analysis, and packaging integration across sub-2nm processes and silicon photonics architectures.

Read more…

23 {{ "2026-09-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Advanced 6-Axis Motion Sensors for Sustainable Smart Devices

STMicroelectronics launches sustainable 6-axis motion sensors featuring super-symmetric gyroscope architectures and dual-accelerometer tracking for industrial and consumer smart applications.

Read more…

22 {{ "2026-09-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-22T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS Develops 5,040 PPI Full-Color OLED Microdisplay

28 nm CMOS technology combines 2.52 µm subpixels and flexible driving modes for efficient AR, VR devices, showcased at Eurodisplay 2026.

Read more…

21 {{ "2026-09-21T00:00:00+00:00" | date "MMM" }} '26

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BAE SYSTEMS News

Development of 45-Nanometer Radiation-Hardened Space Microelectronics

BAE Systems and GlobalFoundries are collaborating to manufacture custom application-specific integrated circuits for space-grade digital infrastructure.

Read more…

21 {{ "2026-09-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-21T00:00:00+00:00" | date "longDate" }}

Nordson Test & Inspection News

Semiconductor Acoustic Inspection and X-Ray Metrology

Nordson introduces advanced acoustic and X-ray systems to enhance defect detection, process control, and throughput across the semiconductor data ecosystem.

Read more…

19 {{ "2026-09-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-19T00:00:00+00:00" | date "longDate" }}

Infineon News

Acquisition of Semiconductor Memory Business Supports Portfolio Optimization

Infineon sells NOR Flash and F-RAM assets to Winbond for $1.12 billion to concentrate resources on primary growth markets.

Read more…

17 {{ "2026-09-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-17T00:00:00+00:00" | date "longDate" }}

Melexis News

Integrated Current Sensors Expand Automotive Power Measurement

Melexis introduces the MLX91224 and MLX91225 isolated current sensor platform, delivering plug-and-play measurement up to 100 ARMS for electric vehicle powertrains, chargers, and industrial power systems.

Read more…

17 {{ "2026-09-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-17T00:00:00+00:00" | date "longDate" }}

Harman News

HARMAN Joins SDVerse Marketplace

HARMAN joins the SDVerse B2B marketplace to provide automakers with expanded access to software-defined vehicle products and engineering solutions.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Accelerating System Design on Advanced Semiconductor Nodes

Synopsys and TSMC collaborate to deploy automated EDA workflows and unified multiphysics verification for high-performance computing components.

FLIR Launches Si2a-LD and Si2a-Pro Fixed Acoustic Imaging Cameras for Continuous Asset Condition Monitoring

Teledyne FLIR completes its Si2a-Series portfolio for continuous condition monitoring.

Siemens & TSMC Automate Advanced Semiconductor Node Design

New agentic workflows accelerate physical verification, thermal analysis, and packaging integration across sub-2nm processes and silicon photonics architectures.

Advanced 6-Axis Motion Sensors for Sustainable Smart Devices

STMicroelectronics launches sustainable 6-axis motion sensors featuring super-symmetric gyroscope architectures and dual-accelerometer tracking for industrial and consumer smart applications.

Fraunhofer IPMS Develops 5,040 PPI Full-Color OLED Microdisplay

28 nm CMOS technology combines 2.52 µm subpixels and flexible driving modes for efficient AR, VR devices, showcased at Eurodisplay 2026.

Development of 45-Nanometer Radiation-Hardened Space Microelectronics

BAE Systems and GlobalFoundries are collaborating to manufacture custom application-specific integrated circuits for space-grade digital infrastructure.

Semiconductor Acoustic Inspection and X-Ray Metrology

Nordson introduces advanced acoustic and X-ray systems to enhance defect detection, process control, and throughput across the semiconductor data ecosystem.

Acquisition of Semiconductor Memory Business Supports Portfolio Optimization

Infineon sells NOR Flash and F-RAM assets to Winbond for $1.12 billion to concentrate resources on primary growth markets.

Integrated Current Sensors Expand Automotive Power Measurement

Melexis introduces the MLX91224 and MLX91225 isolated current sensor platform, delivering plug-and-play measurement up to 100 ARMS for electric vehicle powertrains, chargers, and industrial power systems.

HARMAN Joins SDVerse Marketplace

HARMAN joins the SDVerse B2B marketplace to provide automakers with expanded access to software-defined vehicle products and engineering solutions.

International