The upcoming DeviceEdge AIE-KT and new fanless AIE-PT systems will support NVIDIA Jetson T3000 and T2000 modules, enabling scalable, power-efficient AI computing for robotics and industrial edge applications.
Infineon Technologies AG and LS ELECTRIC are collaborating to develop high-efficiency direct current power infrastructure for AI data centers and next-generation power grids.
This collaborative research project develops bacterial cellulose circuit carriers and additive manufacturing processes for sustainable next-generation printed circuit boards.
ROHM introduces surface-mount power devices with standard footprint compatibility, designed to enhance server power supply efficiency and support high-density industrial applications.
Keysight Technologies has launched Eggplant Find by Description to automate interface element identification using textual descriptions instead of image-based screenshots.
By integrating highly efficient thermoelectric materials into CMOS-compatible manufacturing technology for the first time, the project aims to create significantly more powerful sensors.
Kontron introduces a new generation of semiconductor equipment integration software with platform-independent architecture, open APIs, and enhanced cybersecurity support.
The new MX Controller combines sequence, motion, and network control on a single platform, enabling faster engineering, deterministic communication, and scalable automation for connected manufacturing.