07
'26
Written on
RealMan Robotics
07
'26
Written on
Micron News
Micron Launches World's First Gen5 G9 QLC SSD for Client Computing
The new client SSD combines Gen5 bandwidth, high-density QLC NAND and low-power design to enable compact, AI-capable laptops with higher storage capacity and efficiency.
06
'26
Written on
Kontron News
3.5-inch single board computer for industrial edge AI
Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.
06
'26
Written on
Vecow News
Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3
The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.
06
'26
Written on
Contrinex News
Contrinex Expands Digital Distance Sensors for Flexible Automation
Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.
06
'26
Written on
Mediatek News
MediaTek Advances Wi-Fi 8 Reliability for High-Density Connected Devices
The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.
06
'26
Written on
Aetina
Aetina Introduces AIB-AT Serie for Physical AI and Robotics
The new AIB-AT platforms expand Aetina’s DeviceEdge portfolio with high-performance, low-latency computing designed for industrial robotics and emerging physical AI applications.
05
'26
Written on
Exxelia
Exxelia unveils Smart Integrated Magnetics for space power
Custom high-efficiency magnetic solution for compact, reliable space DC-DC power conversion.
02
'26
Written on
Avnet News
Advanced Chiplet Integration Center for European ASIC Development
Avnet ASIC and Bar-Ilan University are establishing a joint R&D hub to develop 2.5D and 3D chiplet integration based on advanced foundry nodes for European semiconductor applications.
02
'26
Written on
Posifa Technologies News
