TDK Corporation announced today that subsidiary TDK Ventures Inc. President Nicolas Sauvage has been recognized for the third consecutive year on the Global Corporate Venturing (GCV) Powerlist, featured on the Top 20 at #17.
Diodes Incorporated today announced the introduction of a PCIe® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.
The R&S TS-RRM-NR 5G conformance test system from Rohde & Schwarz is the first test platform to achieve test platform approval criteria (TPAC) from the GCF certification organization for 5G radio resource management (RRM) at FR2 frequencies. As a consequence, the first RRM conformance FR2 work items have reached “active” status, making them mandatory for mobile device certification. RRM FR2 test cases with one and two angles of arrival (1xAoA and 2xAoA) have been validated in multiple FR2 EN-DC band combinations.
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Texas Instruments (TI) on Tuesday, May 24, at 11 a.m. CDT titled “Enhanced Protection with TI’s New Isolated USB Repeaters.” The webinar will be presented by TI’s Alfred Chong and Brian Lin.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and MACOM Technology Solutions Holdings Inc., a leading supplier of semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries, have announced the successful production of radio-frequency Gallium-Nitride-on Silicon prototypes.
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that it is the first company to gain acceptance from PTCRB validation group (PVG) for 5G new radio (NR) test cases that support Release 16 (Rel-16) specifications defined by the 3rd Generation Partnership Project (3GPP) telecommunications standards organization.