SiFive is a semiconductor IP company founded in 2015 by the inventors of the open RISC-V instruction set architecture. Its semiconductor IP ranges from high-performance application processors and vector processors to low-power embedded 64- and 32-bit microcontrollers.
Inova Semiconductors, inventor of the APIX®3 standard for real-time gigabit links for automotive applications and Alfamation, supplier of hardware and software test products and turn-key test and measurement solutions for automotive infotainment systems, have announced a close cooperation to speed up the integration of APIX3 technology into automotive applications.
Impulse Embedded, a leading provider of industrial computing systems and solutions, can now supply the ECX-3000 series from Vecow, a fanless embedded system powered by the latest range of Intel 12th Generation Core ‘Alder Lake’ processors. Featuring breakthrough technologies, enhanced graphics and high speed I/O the ECX-3000 series is perfectly suited for IoT, machine vision, in-vehicle computing, public safety and Edge AI applications.
TDK Corporation (TSE:6762) presents the new B78416A* series of compact EPCOS transformers with EP 6 cores for ultrasonic applications. The series comprises five types with transformation ratios between 1:1:8.42 and 1:1:15.
No other sensor technology has such a versatile range of applications as ultrasonic technology: In the industrial sector alone, its applications range from recording filling levels and volume flows and measuring distances, heights, and widths through to detecting objects and obstacles in dynamic processes. Yet depending on their specific application, sensors often require costly modifications in order to work reliably.
Diodes Incorporated (Nasdaq: DIOD) has introduced the DGD0579U high-side and low-side gate driver. This high-frequency device, which has a built-in bootstrap diode, is capable of driving two N-channel MOSFETs in the half-bridge configurations that are commonly used for motor control and DC-DC power delivery functions.
While 5G technology is undoubtedly improving global connectivity capabilities, it has led to challenges for telecoms equipment manufacturers because of the demands imposed by its operation.For example, the frequencies used with 5G raise to much higher than with 4G and those signals cannot easily penetrate some materials and can be easily obstructed, which has led to signal attenuation issues.
Toshiba Electronics Europe GmbH (“Toshiba”) has launched a new normally open (NO) 1-Form-A photorelay that is intended for use in a multitude of battery- and hybrid-electric vehicle applications including within the battery management system (BMS), ground fault detection and identifying faults with mechanical relays.