Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.
Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.
Film capacitors, common mode chokes and power inductors ensure reliable power conversion, electromagnetic compatibility and filtering in demanding deep-space environments.
Infineon develops a new processing unit leveraging external LPDDR4 memory to drive dual high-resolution displays without requiring complex system-on-chip platforms.
New thermal imaging camera delivers 1280 × 1024 HD resolution in the compact A-Series platform, providing a straightforward upgrade path for existing research and test environments.
Keysight, University of Glasgow, NPL, and MPI Corporation have demonstrated a continuous 250 GHz on-wafer measurement methodology for sub-terahertz semiconductor research.