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Siemens News

Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution

Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

Rohde & Schwarz

Rohde & Schwarz introduces the R&S MXO 4 series, the next generation oscilloscopes for accelerated insight

Rohde & Schwarz is adding a completely new series to its oscilloscope portfolio that delivers a number of industry firsts. The new R&S MXO 4 series oscilloscopes feature the world’s fastest real-time update rate of over 4.5 million acquisitions per second. Development engineers can now see more signal detail and infrequent events than with any other oscilloscope.

U Blox News

Move-X chooses u-blox chip-to-cloud positioning solution for its new Cicerone board LoRa connectivity solution

U-blox, a leading global provider of positioning and wireless communication technologies and services, announced today that Move-X has chosen to integrate u-blox positioning technology and u-blox cloud positioning service in their new LoRa connectivity solution - the Cicerone board.

Ampleon News

Ampleon’s “New” standard for L Band, GaN-SiC HEMT

Ampleon will showcase at the European Microwave Week (held in Milan between 27 thru 29 September) our latest solutions and innovative products in GaN and LDMOS technologies. Among the products on display will be ones aimed at wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications.

Lane Electronics News

Nicomatic high-performance micro-connectors available from Lane Electronics

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, can supply a wide range of Nicomatic high-performance micro-connectors from stock.

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