05
'21
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Melexis News
05
'21
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RAFI News
Rugged signal lamp with stainless steel collar and red/green LED
RAFI is expanding its rugged RAFIX 22 FSR control component range with a signal lamp featuring a stainless steel collar with IP65, IP67 and IP69 degree of protection to the front side.
05
'21
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IAR Systems News
IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262
The functional safety edition of IAR Embedded Workbench for RISC-V is certified by TÜV SÜD and delivers guaranteed support through the product life cycle.
05
'21
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FEV News
FEV Offers Unparalleled Capability for Environmental Tests with eDLP
High-voltage batteries, electronics, and other vehicle components are exposed to a variety of punishing environmental influences during their life cycle.
04
'21
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Baumer News
Compact machine designs without compromise
Miniaturized laser distance sensors from Baumer reliably handle precise measurement tasks.
04
'21
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Adlinktech News
ADLINK Adopts Upverter for Full Automation of SMARC Carrier Board Design
ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.
04
'21
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Comau News
Comau North America teams up with wearable robotics association to present MATE-XT webinar
On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).
04
'21
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NXP News
NXP Semiconductors and Morgan Stanley to Present Industrial & IoT Edge Processing Teach-In
NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.
04
'21
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CEA Leti News
CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25
CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".
04
'21
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Hitachi News
