With the new download feature, in acirro+, you can now pull historical process data from the cloud and use them directly in Excel, Microsoft Power BI or a third-party application to uncover insights and perform further analysis and optimization.
By joining the FiRaTM Consortium, Rohde & Schwarz contributes to the organization’s efforts to establish a certification program for UWB devices. Rohde & Schwarz brings along a broad expertise in mobile device testing and certification.
NXP Semiconductors N.V. (NASDAQ: NXPI) today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors.
TTI, Inc., a leading distributor of electronic components, announces the passing of Paul Andrews, TTI founder and CEO. At the helm for 50 years, Andrews’ vision has led TTI to extraordinary success as one of the industry’s leading distributors.
Connectors are designed for bulkhead and pass-through applications and provide vital environmental protection for industries serving in harsh environments.
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, today announced the new RDM-Series silicon photomultiplier (SiPM) array that extends the LiDAR sensor capabilities to its broad portfolio of intelligent sensing solutions.