03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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Beijer Electronics Products AB News

Uncover insights with historical process data from acirro+

With the new download feature, in acirro+, you can now pull historical process data from the cloud and use them directly in Excel, Microsoft Power BI or a third-party application to uncover insights and perform further analysis and optimization.

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03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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EUAutomation News

Tackling obsolescence with additive manufacturing

3D printed spare parts is revolutionizing manufacturing.

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03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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Rohde & Schwarz

Rohde & Schwarz joins the FiRa Consortium to show its commitment to the growing Ultra-Wideband (UWB) ecosystem

By joining the FiRaTM Consortium, Rohde & Schwarz contributes to the organization’s efforts to establish a certification program for UWB devices. Rohde & Schwarz brings along a broad expertise in mobile device testing and certification.

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03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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ZS-Handling GmbH

Contactless Handling of Wafers in the Solar Industry

Gentle and fast handling with ultrasound

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03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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NXP News

NXP Unveils Advanced i.MX Applications Processors with Easy-to-Deploy Security, Energy Efficiency and Scalability for the Industrial and IoT Edge

NXP Semiconductors N.V. (NASDAQ: NXPI) today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors.

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03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMicroelectronics Speeds Smart Devices to Market with Extra Software for Microsoft^® Azure RTOS Projects on STM32 MCUs

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft^®.

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03 {{ "2021-03-03T00:00:00+00:00" | date "MMM" }} '21

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Mouser News

MOUSER ELECTRONICS NEW PRODUCT INSIDER: FEBRUARY 2021

Global Distributor Leads in New Product Introductions.

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02 {{ "2021-03-02T00:00:00+00:00" | date "MMM" }} '21

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TTI News

TTI Family of Companies Remembers Founder and Chief Executive Officer Paul Andrews

TTI, Inc., a leading distributor of electronic components, announces the passing of Paul Andrews, TTI founder and CEO. At the helm for 50 years, Andrews’ vision has led TTI to extraordinary success as one of the industry’s leading distributors.

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02 {{ "2021-03-02T00:00:00+00:00" | date "MMM" }} '21

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TE Connectivity News

TE Connectivity introduces AMPSEAL 16 mini lever 16 and 24 position hybrid connectors for sealed applications

Connectors are designed for bulkhead and pass-through applications and provide vital environmental protection for industries serving in harsh environments.

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02 {{ "2021-03-02T00:00:00+00:00" | date "MMM" }} '21

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ONSEMI News

ON Semiconductor launches World’s First Automotive Qualified SiPM Array Product for LiDAR Applications

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, today announced the new RDM-Series silicon photomultiplier (SiPM) array that extends the LiDAR sensor capabilities to its broad portfolio of intelligent sensing solutions.

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With the new download feature, in acirro+, you can now pull historical process data from the cloud and use them directly in Excel, Microsoft Power BI or a third-party application to uncover insights and perform further analysis and optimization.

3D printed spare parts is revolutionizing manufacturing.

By joining the FiRaTM Consortium, Rohde & Schwarz contributes to the organization’s efforts to establish a certification program for UWB devices. Rohde & Schwarz brings along a broad expertise in mobile device testing and certification.

Gentle and fast handling with ultrasound

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft®.

Global Distributor Leads in New Product Introductions.

TTI, Inc., a leading distributor of electronic components, announces the passing of Paul Andrews, TTI founder and CEO. At the helm for 50 years, Andrews’ vision has led TTI to extraordinary success as one of the industry’s leading distributors.

Connectors are designed for bulkhead and pass-through applications and provide vital environmental protection for industries serving in harsh environments.

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, today announced the new RDM-Series silicon photomultiplier (SiPM) array that extends the LiDAR sensor capabilities to its broad portfolio of intelligent sensing solutions.

International

Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft^®.