New workflows automate RTL checks, debugging and planning while remaining compatible with existing EDA environments and cloud-based development infrastructures.
Support for AWS Outposts racks enables telecom operators to place 5G core processing where latency and traffic conditions require flexible infrastructure design.
SECO and Qualcomm Technologies combine Dragonwing platforms and Clea software to deploy scalable edge computing solutions for industrial automation, smart grid, and advanced HMI applications.
STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.
A joint Open Compute Project workstream aims to define High Bandwidth Flash as a new scalable, power-efficient memory tier for AI inference infrastructure.
Keysight Technologies presents agentic AI, digital twins and network emulation at Mobile World Congress 2026 to validate 5G-Advanced, 6G and non-terrestrial network performance.
TDK Corporation expands its X2 safety film capacitor portfolio with the B3292xU/V series, targeting compact EMI suppression in industrial drives and automotive power electronics.