27
'26
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Exxelia
24
'26
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Toshiba News
Toshiba Expands CMOS Comparators for Overcurrent Protection
New comparator devices support faster shutdown response and low-voltage operation in industrial systems, improving safety across robotics, power electronics, and energy infrastructure.
24
'26
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Vision Components News
Vision Components Introduces Edge AI Camera Modules
New embedded vision systems combine onboard processing, high-resolution sensors, and MIPI interfaces for machine vision, edge analytics, and industrial imaging applications.
24
'26
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BOSCH News
Third-Generation SiC Semiconductors for Electric Mobility
Bosch develops new chips to improve efficiency and power density in electric drivetrain systems.
23
'26
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AMD News
AMD advances desktop CPUs with dual 3D V-Cache processor
Ryzen 9 9950X3D2 integrates dual cache architecture and Zen 5 cores to improve latency, throughput and performance for development and creation workloads.
23
'26
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MURATA News
Murata presents miniaturized sensor systems at Sensors Converge 2026
Sensor fusion, IMUs, AMR sensors and Wi-Fi HaLow enable reliable sensing and connectivity across mobility, medical and industrial applications.
22
'26
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Microchip News
Microchip integrates programmable logic into low-power microcontrollers
CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.
22
'26
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Rohm Semiconductors News
ROHM introduces 5th generation SiC MOSFETs for efficiency
New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.
22
'26
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Congatec News
Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units
Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.
22
'26
Written on
Intel News
