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Fraunhofer News

Split manufacturing for trustworthy electronics "Made in Germany"

A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T". This will enable the secure assembly of subsystems in Germany and safeguard supply chains.

Power Integrations News

Power Integrations Launches PowerPros Live Video Application-Engineering Support

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today launched PowerPros℠, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world.

Rohde & Schwarz

Rohde & Schwarz and China Mobile Research Institute collaborate on 6G JCAS research and early validation

The China Mobile Research Institute and Rohde & Schwarz have joined forces to research and validate joint communication and sensing (JCAS). They plan to use the latest R&S AREG800A automotive radar echo generator from Rohde & Schwarz as an object simulator in a JCAS testing solution, thereby accelerating the research and development of JCAS and readying it for industrialization.


KDSI-SR modular cable entry installed from the outside

Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.

Sivers Semiconductors News

Sivers Photonics and Ayar Labs demonstrate SuperNovaTM multi-wavelength light source with Sivers DFB laser arrays at ECOC 2022

Sivers Semiconductors AB today announces that its subsidiary, Sivers Photonics, has successfully demonstrated its CW-WDM MSA compliant distributed feedback (DFB) laser arrays with Ayar Labs’ SuperNovaTM remote optical source, paving the way for applications such as high performance computing, artificial intelligence, and high density optics.

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