21
'22
Written on
Microchip News
21
'22
Written on
E+E ELEKTRONIK News
HTE & TEE301 Expand Sensing Element Series for Humidity and Temperature
The new HTE301 and TEE301 models see E+E Elektronik expand its digital sensing element portfolio to include two cost-optimised product variants.
21
'22
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Tektronix News
Tektronix Adds Powerful New PCI Express® 6.0 Solution to Accelerate the Next Generation of High-Speed Devices
Tektronix delivers fully automated test and validation solution that renders faster test times, higher-quality measurements, and an intuitive user interface.
21
'22
Written on
CEA Leti News
CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
Accelerated Development for Communication Module Enables Low-Cost Connectivity for Devices in Maritime, Oil & Gas, and Transport Sectors.
21
'22
Written on
Fraunhofer News
Split manufacturing for trustworthy electronics "Made in Germany"
A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T". This will enable the secure assembly of subsystems in Germany and safeguard supply chains.
21
'22
Written on
Power Integrations News
Power Integrations Launches PowerPros Live Video Application-Engineering Support
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today launched PowerPros℠, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world.
20
'22
Written on
Rohde & Schwarz
Rohde & Schwarz and China Mobile Research Institute collaborate on 6G JCAS research and early validation
The China Mobile Research Institute and Rohde & Schwarz have joined forces to research and validate joint communication and sensing (JCAS). They plan to use the latest R&S AREG800A automotive radar echo generator from Rohde & Schwarz as an object simulator in a JCAS testing solution, thereby accelerating the research and development of JCAS and readying it for industrialization.
20
'22
Written on
CONTA-CLIP
KDSI-SR modular cable entry installed from the outside
Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.
20
'22
Written on
Sivers Semiconductors News
Sivers Photonics and Ayar Labs demonstrate SuperNovaTM multi-wavelength light source with Sivers DFB laser arrays at ECOC 2022
Sivers Semiconductors AB today announces that its subsidiary, Sivers Photonics, has successfully demonstrated its CW-WDM MSA compliant distributed feedback (DFB) laser arrays with Ayar Labs’ SuperNovaTM remote optical source, paving the way for applications such as high performance computing, artificial intelligence, and high density optics.
19
'22
Written on
Toshiba News
