16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMicroelectronics Introduces Cost-Efficient NFC Transceiver Enabling New Application Areas and Easing Customer Interaction

The ST25R3918 from STMicroelectronics is a multi-purpose NFC transceiver supporting passive peer-to-peer functionality and NFC card-emulation mode as well as NFC reader operation.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMicroelectronics Delivers First Stellar Advanced Automotive Microcontrollers for New Road-Car Projects

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has begun delivering the first Stellar SR6 automotive microcontrollers (MCUs) for automotive-industry leaders to realize the next generation of advanced vehicle electronics that deliver new levels of performance and safety.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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ANSYS News

Ansys Multiphysics Solutions Achieve Certification for TSMC’s N3 and N4 Process Technologies

Ansys extends collaboration with TSMC to deliver sophisticated power integrity and electromigration signoff solutions for advanced applications.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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Siemens digital Industry Software News

Siemens announces new JEDEC industry standard for electronics cooling simulation

New JEP181 standard, proposed and chaired by Siemens, simplifies exchange of simulation data for thermal digital twins of electronic devices.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK launches 3 new SmartSound MEMS microphones

TDK Corporation (TSE: 6762) introduces three new MEMS microphones as part of the SmartSound family of products for mobile, IoT and other consumer devices.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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Acceed News

Waterproof Box PC with SuperCAP UPS

The new SEMIL-1700 series industrial Box PCs are extremely robust and resistant against weather, dust and vibration influence.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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TE Connectivity News

TE Connectivity’s IPT-HD power bolt high-voltage connector offers a new shielding design for alternative energy vehicles

Shielding design provides low-contact resistance for Motor Control Unit (MCU), E-axle and E-motor applications operating in harsh environments.

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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innodisk

Innodisk Releases Industrial-Grade DDR5 DRAM Modules

The new standard touts a host of crucial performance improvements and power savings over its predecessor, and anticipation has been high since the official announcement of its release

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16 {{ "2021-06-16T00:00:00+00:00" | date "MMM" }} '21

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PEI-Genesis News

Don’t write off the versatile D-Sub connector

The benefits of using a D-Sub connector in industry.

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15 {{ "2021-06-15T00:00:00+00:00" | date "MMM" }} '21

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ST News

STMICROELECTRONICS AND POLITECNICO DI MILANO ANNOUNCE AGREEMENT ON RESEARCH CENTER FOR ADVANCED SENSORS

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Politecnico di Milano, a scientific-technological university, which trains engineers, architects and industrial designers, announced today a five-year collaboration agreement in the presence of Italy’s Minister of Economic Development Giancarlo Giorgetti. At the heart of the agreement is the establishment of a joint research center on advanced materials for sensors (STEAM), leveraging the long-standing collaboration between ST and Politecnico. The joint research center has been created to give professors, researchers, and PhDs a unique opportunity in Italy, namely all the means to conceive, design and develop MEMS technology and to create new MEMS products.

Read more…

The ST25R3918 from STMicroelectronics is a multi-purpose NFC transceiver supporting passive peer-to-peer functionality and NFC card-emulation mode as well as NFC reader operation.

Ansys extends collaboration with TSMC to deliver sophisticated power integrity and electromigration signoff solutions for advanced applications.

New JEP181 standard, proposed and chaired by Siemens, simplifies exchange of simulation data for thermal digital twins of electronic devices.

TDK Corporation (TSE: 6762) introduces three new MEMS microphones as part of the SmartSound family of products for mobile, IoT and other consumer devices.

The new SEMIL-1700 series industrial Box PCs are extremely robust and resistant against weather, dust and vibration influence.

Shielding design provides low-contact resistance for Motor Control Unit (MCU), E-axle and E-motor applications operating in harsh environments.

The new standard touts a host of crucial performance improvements and power savings over its predecessor, and anticipation has been high since the official announcement of its release

The benefits of using a D-Sub connector in industry.

International