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3D SYSTEMS News
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Bopla News
Technical Enclosure Solutions and Printed Electronics at electronica 2026
BOPLA presents innovative enclosure systems such as BoNext and BoVersa as well as transparent film heaters and antennas at electronica in Munich from November 10 to 13, 2026.
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SEW-EURODRIVE
SEW-EURODRIVE Launches LM3S Electric Cylinder Series for High-Performance Linear Motion
Next-generation electric cylinders deliver higher force, simplified integration, and maintenance-free operation for demanding automation applications.
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innodisk
Innodisk Launches DDR5 8000 RDIMM for Edge AI and High-Performance Computing
The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.
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Keysight technologies News
Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing
Keysight collaborates with the Berkeley Wireless Research Center (BWRC) to pioneer flexible, high-efficiency OTA measurement techniques for emerging 6G systems and upper-midband spectrum applications.
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Diodes Incorporated News
Advanced Rectifiers Enhance Automotive Efficiency
Diodes Incorporated introduces a new family of field-plated Super Barrier Rectifier products designed to optimize performance within the automotive data ecosystem and modern vehicle power architectures.
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Toshiba News
Toshiba Introduces 3300V Dual SiC MOSFET Power Module
High surge current capability and low conduction losses enhance conversion efficiency and operational resilience across heavy rail traction and grid infrastructure.
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Renesas News
Ultra-Compact Configurable Mixed-Signal ICs
Renesas offers a highly miniaturized configurable hardware solution designed to consolidate analog and digital logic functions within space-constrained wearable technology hardware.
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Samsung News
Adaptive High-Bandwidth Memory for Mobile AI
Samsung validates its next-generation LPDDR memory on Qualcomm’s mobile platform to address rising bandwidth and power demands of edge AI.
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Qualcomm News
