06
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BASF News
02
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Texas Instruments News
TI expands Zephyr RTOS support across its embedded hardware portfolio
Unified Zephyr platform supports TI MCUs, MPUs and wireless devices, enabling code portability, security updates and streamlined development across hardware.
01
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Synopsys News
Autonomous Multi-Domain Orchestration Platform for Silicon and Systems Engineering
Synopsys has introduced the Autopilot Platform alongside a portfolio of specialized AgentEngineer solutions designed to automate complex, multi-step engineering workflows across the semiconductor and systems design industries.
01
'26
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TDK News
TDK Corporation Exhibits EV Power Solutions in Detroit
TDK Corporation highlighted its latest technical components and power architectures for electric vehicles and fast-charging infrastructure at the Electric & Hybrid Vehicle Technology Expo in Detroit, Michigan.
01
'26
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TDK News
High-Temperature DC-Link Film Capacitors for Automotive Power Electronics
TDK Corporation presents B3272*A/G/T series film capacitors operating up to 135 °C to resolve thermal stress in electric vehicle inverters.
01
'26
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Toshiba News
Dual-Channel Digital Isolators for Low-Power Industrial Signal Isolation
Toshiba Electronic Devices & Storage Corporation releases the DCL32xx00 Series digital isolators to eliminate ground loops in compact industrial equipment.
30
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Microchip News
New Ethernet Solutions for Automotive and Industrial Zonal Architectures
Microchip expands its SPE portfolio with the LAN8679 and LAN8680 transceivers and the LAN8660X/1X/2X terminal node family to extend network edge connectivity.
30
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Baumer News
Baumer introduces new 5 GigE industrial cameras for machine vision at the Vision 2026 trade show
Baumer presents compact 5 GigE industrial cameras with high integration flexibility for industrial automation at the Vision 2026 trade show held in Stuttgart from September 29 to October 1, 2026.
30
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MURATA News
Miniature Low-ESL MLCC Technology for High-Frequency Power Decoupling
Murata begins mass production of 0201-inch three-terminal MLCCs in the LLD series to minimize parasitic inductance in space-constrained mobile electronics.
30
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BASLER News
