What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
When designing industrial equipment, the operating temperature of the product is often at the top of the list for design engineers. This makes sense, after all, you don’t want to keep replacing failed equipment. However, while engineers give a lot of thought to heat in the equipment itself, the performance of the connectors and cables that join different devices is often overlooked. Here, Jonathan Parry, Senior Vice President of Global Operations and European Managing Director at cables and connectors specialist PEI-Genesis, explains how to choose an extreme temperature connector.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Sanken Electric Co., Ltd (TSE: 6707), a leader in innovative technology specializing in semiconductor devices, power modules, and sensors, have collaborated to unleash the performance and practical advantages of intelligent power modules (IPM) in high-voltage, high-power equipment designs.