11 {{ "2024-04-11T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-11T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Corporation announces additional output voltage models to the 250W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2” x 4” footprint

2” x 4” 250W medical and industrial power supply series extended to include five additional output voltages.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec introduces 3.5-inch application carrier board for COM-HPC Mini modules

congatec presents the first board-level product in line with its recently introduced aReady. strategy.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

TDK News

TDK presents enhanced embedded motor controllers with increased memory, power, and reliability

Capable of 4 x 1 A peak current for driving brushless DC (BLDC), brushed DC (BDC), and stepper motors. Featuring 4 KB SRAM, 2 KB EEPROM in 32 KB, and 64 KB flash memory variants.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

Machine vision meets automation and robotics: IDS at Automate 2024, booth 2855

IDS presents the latest in 3D vision technology.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

EInfochips News

EInfochips Unveils New Aikri Modules and Kits, Elevating IoT Edge Solutions powered by Qualcomm

EInfochips introduces the Aikri-64X-90XX series, featuring modules and developer kits powered by Qualcomm^® QCS6490 processor, paving the way for AI-driven edge computing solutions.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron COM Express^® and SMARC modules with next-generation low-power Intel Atom^® processors

Three module platforms with Intel Atom^® series x7000E/x7000RE, Intel^® Processor N series, and Intel^® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Seco News

SECO introduces new COM Express^® Type 6 module powered by Intel^® Atom^® Processors x7000RE Series

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel^® Next Gen Atom^® processors.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon expands automotive offering with programmable high voltage PSoC™ 4 HVMS family for touch-enabled HMI and other smart sensing applications

In the automotive industry, security and functional safety are playing an increasingly important role even in low-end microcontroller applications.

Read more…

10 {{ "2024-04-10T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-10T00:00:00+00:00" | date "longDate" }}

AMD News

AMD PRESENTS NEW VERSAL SERIES GEN 2 DEVICES

The new Versal Series Gen 2 devices deliver end-to-end acceleration for AI-driven embedded systems.

Read more…

Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

TDK Corporation announces additional output voltage models to the 250W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2” x 4” footprint

2” x 4” 250W medical and industrial power supply series extended to include five additional output voltages.

congatec introduces 3.5-inch application carrier board for COM-HPC Mini modules

congatec presents the first board-level product in line with its recently introduced aReady. strategy.

TDK presents enhanced embedded motor controllers with increased memory, power, and reliability

Capable of 4 x 1 A peak current for driving brushless DC (BLDC), brushed DC (BDC), and stepper motors. Featuring 4 KB SRAM, 2 KB EEPROM in 32 KB, and 64 KB flash memory variants.

Machine vision meets automation and robotics: IDS at Automate 2024, booth 2855

IDS presents the latest in 3D vision technology.

EInfochips Unveils New Aikri Modules and Kits, Elevating IoT Edge Solutions powered by Qualcomm

EInfochips introduces the Aikri-64X-90XX series, featuring modules and developer kits powered by Qualcomm^® QCS6490 processor, paving the way for AI-driven edge computing solutions.

Kontron COM Express^® and SMARC modules with next-generation low-power Intel Atom^® processors

Three module platforms with Intel Atom^® series x7000E/x7000RE, Intel^® Processor N series, and Intel^® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

SECO introduces new COM Express^® Type 6 module powered by Intel^® Atom^® Processors x7000RE Series

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel^® Next Gen Atom^® processors.

Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

Infineon expands automotive offering with programmable high voltage PSoC™ 4 HVMS family for touch-enabled HMI and other smart sensing applications

In the automotive industry, security and functional safety are playing an increasingly important role even in low-end microcontroller applications.

AMD PRESENTS NEW VERSAL SERIES GEN 2 DEVICES

The new Versal Series Gen 2 devices deliver end-to-end acceleration for AI-driven embedded systems.

International

Technical Articles

2” x 4” 250W medical and industrial power supply series extended to include five additional output voltages.

congatec presents the first board-level product in line with its recently introduced aReady. strategy.

Capable of 4 x 1 A peak current for driving brushless DC (BLDC), brushed DC (BDC), and stepper motors. Featuring 4 KB SRAM, 2 KB EEPROM in 32 KB, and 64 KB flash memory variants.

IDS presents the latest in 3D vision technology.

EInfochips introduces the Aikri-64X-90XX series, featuring modules and developer kits powered by Qualcomm® QCS6490 processor, paving the way for AI-driven edge computing solutions.

Three module platforms with Intel Atom® series x7000E/x7000RE, Intel® Processor N series, and Intel® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel® Next Gen Atom® processors.

Silicon Labs has announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date.

In the automotive industry, security and functional safety are playing an increasingly important role even in low-end microcontroller applications.

The new Versal Series Gen 2 devices deliver end-to-end acceleration for AI-driven embedded systems.

International

EInfochips introduces the Aikri-64X-90XX series, featuring modules and developer kits powered by Qualcomm^® QCS6490 processor, paving the way for AI-driven edge computing solutions.

Three module platforms with Intel Atom^® series x7000E/x7000RE, Intel^® Processor N series, and Intel^® Core™ i3-N305 processor for a wide range of IoT/industrial applications.

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel^® Next Gen Atom^® processors.