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Siemens digital Industry Software News

Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Panasonic Industry News

New 1500V PhotoMOS® relay in miniature DIP5 package from Panasonic targets industrial BMS

The new PhotoMOS® HE relay series from Panasonic Industry Europe offers 5kV I/O isolation and an increased clearance and creepage distance on output side, plus miniature 1-Form-A DIP5 packaging, making it particularly suitable as the switching solution for Battery Management Systems (BMS) in storage systems, charging stations, and numerous other high voltage measurement and infrastructure.

Digi-Key News

Digi-Key Electronics Announces 2022 Back2School Prize Draw

Digi-Key Electronics, which offers the world’s largest selection of electronic components and automation products in stock for immediate shipment, has opened its highly-anticipated annual Back2School Prize Draw sweepstakes, which gives college students an opportunity to win prizes that empower them to use real-world engineering tools and resources.

CK Switches News

C&K Adds Waterproof Version to Side-Actuated Tact Switch Family

C&K, now a part of Littelfuse Inc, and a leading manufacturer of high-quality electromechanical switches, has extended its PTS645V tactile switch series to include an IP67-rated version. The high-performance PTS645V waterproof switch can withstand harsh environmental conditions found in a wide-range of indoor and outdoor applications.

Fraunhofer News

Fraunhofer and Leibniz institutes kick off the "Green ICT @ FMD" competence center

In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).

Keysight technologies News

Keysight Technologies, Jiyun Technologies Collaborate to Deliver a Tailored, Compact Battery Test System

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a collaboration with Jiyun Technologies to develop and deliver a tailored, compact battery test system for electric vehicles (EVs).

Rohde & Schwarz

Rohde & Schwarz paves way for early sub-THz research activities with new R&S FE170 D band frontend extensions

Rohde & Schwarz presents an innovative signal generation and analysis solution for measurements in the D band that will significantly simplify early next generation mobile communications research. The new R&S FE170 frontend extensions are easy to mount to and configure with the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer. The extensions will allow the two high-end test instruments to cover frequency ranges between 110 GHz and 170 GHz – key spectrum for beyond 5G, for 6G technology and for future automotive radar applications.

CEVA News

CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs

CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN, the industry's first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).

Sivers Semiconductors News

Sivers Semiconductors exhibits together with Richardson RFPD at European Microwave Week 2022

Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will exhibit at the European Microwave Exhibition, 27-29 September, during the European Microwave Week in Milan, Italy, together with its partner Richardson RFPD in booth #C28.

Rohde & Schwarz

Rohde & Schwarz exhibits leading-edge test solutions for the 5G ecosystem at Mobile World Congress Las Vegas

As the mobile industry is coming together at Mobile World Congress 2022 in Las Vegas, it becomes clear that 5G is already all around us. The technology is being rolled out with unprecedented speed of adoption in devices, mobile network infrastructure and network deployment.

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