29
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TDK News
29
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Microchip News
Microchip introduces post-quantum root of trust controllers
New controllers support post-quantum cryptography and secure boot for data center, telecom and infrastructure platforms.
29
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Rohm Semiconductors News
ROHM NFC Chipset Enables Wireless Charging in Wearables
Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics.
28
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Kyocera News
Multilayer Ceramic Substrate for AI Semiconductor Packaging
Kyocera Corporation introduces a rigid ceramic core substrate to address warpage and wiring density limits in advanced AI and ASIC semiconductor packaging.
28
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MURATA News
Murata introduces ultra-low power AMR sensors
New AMR sensors enable low-voltage operation and extended battery life in healthcare, wearable, and IoT applications.
27
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Exxelia
Next-Generation SMD High Voltage Mica Capacitors: CM-HVLP Power, easy integration, and Miniaturization
Exxelia announces the introduction of a new generation of high-voltage reconstituted mica capacitors designed to combine pulse and filtering capabilities within a compact SMD package.
24
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Toshiba News
Toshiba Expands CMOS Comparators for Overcurrent Protection
New comparator devices support faster shutdown response and low-voltage operation in industrial systems, improving safety across robotics, power electronics, and energy infrastructure.
24
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Vision Components News
Vision Components Introduces Edge AI Camera Modules
New embedded vision systems combine onboard processing, high-resolution sensors, and MIPI interfaces for machine vision, edge analytics, and industrial imaging applications.
24
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BOSCH News
Third-Generation SiC Semiconductors for Electric Mobility
Bosch develops new chips to improve efficiency and power density in electric drivetrain systems.
23
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AMD News
