26
'25
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Peraso News
26
'25
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Rohm Semiconductors News
ROHM unveils 100V wide-SOA MOSFET for next-gen AI servers
Compact 5×6mm DFN5060-8S device offers 4.0mΩ RDS(on), strong SOA performance at 48V, enabling efficient high-density hot-swap power designs.
26
'25
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Microchip News
Microchip endpoint devices accelerate new zonal car connectivity
The new 10BASE-T1S devices provide a simple, cost-effective connection from remote sensors to zonal gateways, greatly accelerating the next-generation automotive architecture.
26
'25
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Congatec News
congatec takes embedded ARM modules to a new level of performance
New COM-HPC Mini module from congatec with Qualcomm Dragonwing IQ-X processors opens up new applications.
25
'25
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Sivers Semiconductors News
Sivers and Doosan Advance Development of Ka-Band SATCOM Antenna Panels
Sivers and Doosan launch a USD 1.5M program to develop scalable Ka-band ESA panels powered by advanced multi-beam SATCOM BFICs.
25
'25
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Rutronik News
Rutronik Expands Panasonic Capacitor Lineup for Diverse Applications
Panasonic’s ZC and ZVU capacitors offer low ESR, high ripple current, and long service life for automotive and industrial high-temperature applications.
24
'25
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Vecow News
Vecow Unveils Rugged Computing Platforms for Harsh Global Deployments
New MIL-grade, EN50155, TEMPEST-ready and DNV-compliant systems deliver wide-temperature endurance, shock resistance, secure connectivity, and reliable Edge AI performance in extreme environments.
21
'25
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Sivers Semiconductors News
Sivers and Tachyon Partner to Scale Next-Gen 28GHz FWA
Sivers Semiconductors wins a $3M order as Tachyon adopts its TRB02801-based 28GHz antenna modules to advance scalable mmWave FWA deployments from 2026.
20
'25
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ADLINK News
ADLINK Unveils New NXP i.MX 95 Edge Computing Modules
ADLINK’s new SMARC and OSM modules with NXP i.MX 95 processors provide AI acceleration, multicore performance, and long lifecycle support for diverse edge applications.
20
'25
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HMS Industrial Networks AB
