08
'23
Written on
Sivers Semiconductors News
08
'23
Written on
ST News
STMICROELECTRONICS LAUNCHES NEW ISPU TOOLCHAIN AND SOFTWARE PACKAGE
The new toolchain and software package from STMicroelectronics ease the development of edge processing with intelligent inertial sensors.
05
'23
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Rutronik Info
Rutronik and KEMET's T598 Automotive Series expands portfolio for maximum value
KEMET introduces capacitors with the highest capacitance and lowest ESR values for automotive-qualified polymer capacitors, AEC-Q200 certified.
05
'23
Written on
Infineon News
Infineon's new wireless power transmitter IC is ideal for charging up to 50 W
Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.
05
'23
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Mouser News
Mouser Expands Sensor Portfolio to Offer More Real-World Interaction
Mouser Electronics, Inc, recently added several new sensor products to its already comprehensive sensing portfolio.
05
'23
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Exxelia
JUICE Mission to Jupiter: Exxelia high reliability passive components ready to withstand extreme space conditions
Exxelia, one of the world leaders in high-performance passive component design and manufacturing, is proud to announce that its capacitors and magnetics have been selected for use in the European Space Agency's (ESA) JUICE (Jupiter Icy Moons Explorer) mission.
04
'23
Written on
Leuze
Leuze announces a change of management
Leuze is placing its strong growth on a broader footing and has expanded its executive management. Xavier Hamers joined the company on April 1, 2023.
04
'23
Written on
Anritsu News
Anritsu–MediaTek Collaboration Successfully Verified Wi-Fi 7 Chip Connection with Network Mode
Anritsu Corporation and MediaTek Incorporated (MediaTek) have successfully verified the performance and functions of MediaTek’s Filogic chip for IEEE802.11be wireless LAN (WLAN) by testing RF characteristics with the network mode.
04
'23
Written on
Infineon News
Infineon further diversifies its silicon carbide supplier base; new supplier agreement with SICC on wafers and boules
Infineon Technologies AG has signed an agreement with Chinese silicon carbide (SiC) supplier SICC to diversify Infineon's SiC material supplier base and to secure additional competitive SiC sources.
04
'23
Written on
Deltaq News
