15 {{ "2025-05-15T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon and Visteon Collaborate on Advanced Power Conversion Systems for Next-Generation Electric Vehicles

Infineon Technologies announced that the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.

Read more…

15 {{ "2025-05-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-15T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung’s 12nm-class Automotive LPDDR5X: DRAM for safety-critical centralized automotive systems

Automotive E/E architectures are shifting to centralized designs for better performance, cost-efficiency, and safety—driving demand for high-speed, reliable LPDDR5X automotive-grade memory.

Read more…

14 {{ "2025-05-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-14T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Expands USB Standards Support in System Designer for USB

Supports the latest USB standards (USB4 Gen2, Gen3, Gen4) and boosts design productivity with a smart, simulation-driven virtual compliance workflow.

Read more…

14 {{ "2025-05-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-14T00:00:00+00:00" | date "longDate" }}

OMRON News

OMRON reveals ultra-compact power relay for  high-voltage battery safety

The new G9EJH-1-E brings class-leading miniaturization and industry-standard insulation to electric vehicle and energy-storage systems charging.

Read more…

14 {{ "2025-05-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-14T00:00:00+00:00" | date "longDate" }}

Pickering Electronics News

Reed Relays Prove Critical for Precision Semiconductor Testing, Reveals Pickering Guide

Pickering Electronics’ expert guide outlines how reed relays optimize semiconductor wafer testing, offering reliability and precision for ATE systems in parametric and functional validation.

Read more…

14 {{ "2025-05-14T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-14T00:00:00+00:00" | date "longDate" }}

TDK News

TDK chip beads offer 8 A, highest current for EMC lines

TDK's new MPZ1608-PH chip beads support 8 A current, reducing circuit size, improving reliability for automotive and industrial power lines.

Read more…

13 {{ "2025-05-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-13T00:00:00+00:00" | date "longDate" }}

wenglor News

Wenglor presents GM04 Gloss Sensors for Reliable Surface Inspection

In the compact M design (57.3 × 27 × 16 mm), they ensure stable object detection in a working range of 5 to 40 mm.

Read more…

13 {{ "2025-05-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-13T00:00:00+00:00" | date "longDate" }}

Sense Media Group Info

Now Live: The Full Technical Agenda for AutoSens USA 2025!

Join us June 10–12 at Huntington Place, Detroit, for expert tutorials, keynotes, panels, and sessions on cutting-edge automotive sensing and in-cabin tech.

Read more…

13 {{ "2025-05-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-13T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

AI and streaming meet ruggedness

IDS NXT oslo with IP69K ingress protection code expands IDS AI portfolio.

Read more…

13 {{ "2025-05-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-13T00:00:00+00:00" | date "longDate" }}

BenQ

BenQ Group Unveils "AI WOW" Experience at COMPUTEX 2025

The Group's exhibition scale this year is twice that of the previous year, which presents a challenge in terms of reducing the carbon emissions goal by 30%.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Infineon and Visteon Collaborate on Advanced Power Conversion Systems for Next-Generation Electric Vehicles

Infineon Technologies announced that the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.

Samsung’s 12nm-class Automotive LPDDR5X: DRAM for safety-critical centralized automotive systems

Automotive E/E architectures are shifting to centralized designs for better performance, cost-efficiency, and safety—driving demand for high-speed, reliable LPDDR5X automotive-grade memory.

Keysight Expands USB Standards Support in System Designer for USB

Supports the latest USB standards (USB4 Gen2, Gen3, Gen4) and boosts design productivity with a smart, simulation-driven virtual compliance workflow.

OMRON reveals ultra-compact power relay for  high-voltage battery safety

The new G9EJH-1-E brings class-leading miniaturization and industry-standard insulation to electric vehicle and energy-storage systems charging.

Reed Relays Prove Critical for Precision Semiconductor Testing, Reveals Pickering Guide

Pickering Electronics’ expert guide outlines how reed relays optimize semiconductor wafer testing, offering reliability and precision for ATE systems in parametric and functional validation.

TDK chip beads offer 8 A, highest current for EMC lines

TDK's new MPZ1608-PH chip beads support 8 A current, reducing circuit size, improving reliability for automotive and industrial power lines.

Wenglor presents GM04 Gloss Sensors for Reliable Surface Inspection

In the compact M design (57.3 × 27 × 16 mm), they ensure stable object detection in a working range of 5 to 40 mm.

Now Live: The Full Technical Agenda for AutoSens USA 2025!

Join us June 10–12 at Huntington Place, Detroit, for expert tutorials, keynotes, panels, and sessions on cutting-edge automotive sensing and in-cabin tech.

AI and streaming meet ruggedness

IDS NXT oslo with IP69K ingress protection code expands IDS AI portfolio.

BenQ Group Unveils "AI WOW" Experience at COMPUTEX 2025

The Group's exhibition scale this year is twice that of the previous year, which presents a challenge in terms of reducing the carbon emissions goal by 30%.

International