29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-29T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec showcases high-performance embedded building blocks at ElectroneX 2025

congatec presents modular computing platforms, including COM-HPC, SMARC, and COM Express ecosystems, enabling scalable, energy-efficient, and rugged embedded solutions.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-29T00:00:00+00:00" | date "longDate" }}

TDK News

TDK showcases latest solutions for green & digital transformation

At PCIM and SENSOR+TEST, TDK presents advanced passive components and sensor technologies for renewable energy, e-mobility, AI, and industry.

Read more…

29 {{ "2025-04-29T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-29T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Presents Power Step 2 Click Board for Advanced Automation

Power Step 2 Click is a mikroBUS-compatible motor driver that leverages STMicroelectronics’ powerSTEP01 IC for 1/128 microstepping, 85V operation, and 10A RMS current control.

Read more…

28 {{ "2025-04-28T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-28T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Unveils High-Density Power Module for Edge AI

The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Read more…

28 {{ "2025-04-28T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-28T00:00:00+00:00" | date "longDate" }}

Pulsiv

Pulsiv Introduces Ultra-Efficient, Low-Heat USB-C Power Modules for Installed Applications

Pulsiv launches groundbreaking 65-70W USB-C modules with 32°C max operating temperature and 97.34% efficiency at PCIM 2025 in Nuremberg, Germany, from May 6–8 at Hall 6 Booth 250.

Read more…

25 {{ "2025-04-25T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-25T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

Siemens and TSMC Partner to Advance Chip Innovation by 2025

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Signal Hound

Signal Hound Releases the VNA400, 2-Port, 40 GHz Vector Network Analyzer - Now in Stock and Available to Order

High-performance, USB-powered 40 GHz VNA delivers fast, precise measurements—ideal for lab, production, and field use.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

ANSYS News

Ansys Tools Certified for TSMC 16A Process

TSMC and Ansys advance AI workflows for design and photonic optimization on COUPE, with RedHawk-SC and HFSS-IC Pro certified for advanced nodes.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Simplifies Analog Design with New PIC16F17576 MCUs

Discover how Microchip's latest MCU family integrates smart analog peripherals, enabling easier capture of fluctuating signals and lowering overall system design costs.

Read more…

24 {{ "2025-04-24T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-04-24T00:00:00+00:00" | date "longDate" }}

Rutronik News

The OSLON Black SFH 471XB series from ams OSRAM – new at Rutronik

Rutronik is introducing the OSLON Black SFH 471XB infrared LEDs from ams OSRAM with the latest IR:6 thinfilm chip technology.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

congatec showcases high-performance embedded building blocks at ElectroneX 2025

congatec presents modular computing platforms, including COM-HPC, SMARC, and COM Express ecosystems, enabling scalable, energy-efficient, and rugged embedded solutions.

TDK showcases latest solutions for green & digital transformation

At PCIM and SENSOR+TEST, TDK presents advanced passive components and sensor technologies for renewable energy, e-mobility, AI, and industry.

MIKROE Presents Power Step 2 Click Board for Advanced Automation

Power Step 2 Click is a mikroBUS-compatible motor driver that leverages STMicroelectronics’ powerSTEP01 IC for 1/128 microstepping, 85V operation, and 10A RMS current control.

Microchip Unveils High-Density Power Module for Edge AI

The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Pulsiv Introduces Ultra-Efficient, Low-Heat USB-C Power Modules for Installed Applications

Pulsiv launches groundbreaking 65-70W USB-C modules with 32°C max operating temperature and 97.34% efficiency at PCIM 2025 in Nuremberg, Germany, from May 6–8 at Hall 6 Booth 250.

Siemens and TSMC Partner to Advance Chip Innovation by 2025

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

Signal Hound Releases the VNA400, 2-Port, 40 GHz Vector Network Analyzer - Now in Stock and Available to Order

High-performance, USB-powered 40 GHz VNA delivers fast, precise measurements—ideal for lab, production, and field use.

Ansys Tools Certified for TSMC 16A Process

TSMC and Ansys advance AI workflows for design and photonic optimization on COUPE, with RedHawk-SC and HFSS-IC Pro certified for advanced nodes.

Microchip Simplifies Analog Design with New PIC16F17576 MCUs

Discover how Microchip's latest MCU family integrates smart analog peripherals, enabling easier capture of fluctuating signals and lowering overall system design costs.

The OSLON Black SFH 471XB series from ams OSRAM – new at Rutronik

Rutronik is introducing the OSLON Black SFH 471XB infrared LEDs from ams OSRAM with the latest IR:6 thinfilm chip technology.

International

Technical Articles

congatec presents modular computing platforms, including COM-HPC, SMARC, and COM Express ecosystems, enabling scalable, energy-efficient, and rugged embedded solutions.

At PCIM and SENSOR+TEST, TDK presents advanced passive components and sensor technologies for renewable energy, e-mobility, AI, and industry.

Power Step 2 Click is a mikroBUS-compatible motor driver that leverages STMicroelectronics’ powerSTEP01 IC for 1/128 microstepping, 85V operation, and 10A RMS current control.

The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring.

Pulsiv launches groundbreaking 65-70W USB-C modules with 32°C max operating temperature and 97.34% efficiency at PCIM 2025 in Nuremberg, Germany, from May 6–8 at Hall 6 Booth 250.

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

High-performance, USB-powered 40 GHz VNA delivers fast, precise measurements—ideal for lab, production, and field use.

TSMC and Ansys advance AI workflows for design and photonic optimization on COUPE, with RedHawk-SC and HFSS-IC Pro certified for advanced nodes.

Discover how Microchip's latest MCU family integrates smart analog peripherals, enabling easier capture of fluctuating signals and lowering overall system design costs.

Rutronik is introducing the OSLON Black SFH 471XB infrared LEDs from ams OSRAM with the latest IR:6 thinfilm chip technology.

International

High-performance, USB-powered 40 GHz VNA delivers fast, precise measurements—ideal for lab, production, and field use.