At the EMV 2025 tradeshow in Stuttgart, Rohde & Schwarz displays for the first time its R&S HF1444G14 High-gain EMI microwave antenna with outstanding performance.
TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.
Southco has extended its successful line of captive hardware with a new version that features lever-actuated operation for faster and easier latching and unlatching of electronic components. Southco’s compact lever-actuated 56 Spring-Loaded Plunger offers an improved grip for simplified hand operation and saves time when installing or removing components in tight spaces.
High-performance “Zen 5” architecture offers server-grade performance and efficiency combined with purpose-built features for optimized product longevity and system resiliency.
Infineon Technologies AG is launching Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO and PSOC that facilitates a rapid start into automotive software development.
The EV revolution aims to cut emissions, with 350m EVs expected by 2030. Sustainable battery lifecycles are crucial for long-term green transition and reducing environmental impact.
Rohde & Schwarz presents the new R&S NRP140TWG(N) thermal power sensor, designed to meet the growing demands of applications in the F band utilizing a WR 8 waveguide connector.