JUMPtec, a Kontron subsidiary, launches a COM Express Type 6 module with Intel Core Ultra processors, featuring AI Boost NPU and Intel Arc GPU for efficient AI-driven vision processing and automation.
Cambridge GaN Devices introduces Combo ICeGaN, a hybrid GaN-IGBT technology that enhances EV powertrain efficiency while reducing costs, to be showcased at APEC 2025 in Atlanta, Georgia, from March 16-20.
KYOCERA AVX partners with STMicroelectronics to enhance antenna solutions and support seamless integration into ST’s ecosystem, with the collaboration highlighted at Embedded World 2025 in Nuremberg from March 11–13.
LE310 LTE Cat. 1 bis module series and SL871K2 L1 GNSS module can be combined for asset tracking, telematics, and other applications that require an ultra-compact, cost-effective solution for cellular connectivity and satellite location.
FR3 aims to bridge the gap between the extensive coverage of FR1 and the high capacity of FR2, making it a versatile option for future network demands.