Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.
KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.
At the EMV 2025 tradeshow in Stuttgart, Rohde & Schwarz displays for the first time its R&S HF1444G14 High-gain EMI microwave antenna with outstanding performance.
TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.
Southco has extended its successful line of captive hardware with a new version that features lever-actuated operation for faster and easier latching and unlatching of electronic components. Southco’s compact lever-actuated 56 Spring-Loaded Plunger offers an improved grip for simplified hand operation and saves time when installing or removing components in tight spaces.
High-performance “Zen 5” architecture offers server-grade performance and efficiency combined with purpose-built features for optimized product longevity and system resiliency.
Infineon Technologies AG is launching Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO and PSOC that facilitates a rapid start into automotive software development.