Renesas and Altium unveil Renesas 365, a groundbreaking solution integrating silicon, software, and lifecycle management, with live demonstrations at embedded world 2025, March 11-13, in Nuremberg, Germany.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a significant milestone in automotive cybersecurity. The company received ISO/SAE 21434 certification for its AURIX™ TC4Dx microcontroller.
New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.
The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.
Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.
Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon® platforms at its Embedded World debut.