06
'26
Written on
HTDS News
03
'26
Written on
Samsung News
Samsung Unveils HBM4E and Integrated AI Memory Infrastructure
Samsung Electronics has introduced its HBM4E memory architecture and Heat Path Block cooling technology at the COMPUTEX 2026 trade show.
02
'26
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TDK News
Automotive Gate Drive Transformers for High Voltage Vehicle Platforms
TDK Corporation introduces the E13 EM series of compact surface mount transformers for electric vehicle battery isolation systems.
02
'26
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Molex News
High-Speed Automotive Ethernet Connector System Delivers 25Gbps Network Speeds
Molex has expanded its high-speed interconnect portfolio to meet the growing bandwidth demands of advanced driver-assistance systems and centralized vehicle compute architectures.
01
'26
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Toshiba News
Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies
New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications.
01
'26
Written on
Keysight technologies News
Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow
Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.
01
'26
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binder Connector News
binder transforms components into intelligent systems through printed electronics
By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.
30
'26
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Wooptix News
Integration of wavefront phase imaging into semiconductor metrology
Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.
30
'26
Written on
AMD News
AMD's systems-on-chip integrate memory directly
New AMD's SoC integrates up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.
29
'26
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Melexis News
