U-blox, a global provider of leading positioning and wireless communication technologies and services, has announced the u-blox ZED-F9K-01A, a high-precision GNSS module with embedded advanced hardware, software, and latest generation IMU (Inertial Measurement Unit) to provide an advanced, self-contained positioning solution.
Innodisk, a global leader in industrial-grade storage and embedded peripherals recently announced its shift towards the AI industry. As 50% of Innodisk's AI development is related to image recognition, the company has also launched a new camera module series to further support image recognition technology.
“Following major strategic partnerships concluded early this year, the race was on to implement them on the ground. We’re pleased that it’s in Switzerland, the country where our solution was designed, that Wearin’ is applying its unique IoT and artificial intelligence technology at the service of the connected human.” – Jonathan Brossard, Conextivity Group CEO.
Omron Electronic Components Europe has announced the introduction of its B5WC Colour Sensor, which enables monitoring of equipment, plant, and industrial processes through detection of small colour changes. Specific applications are being developed through co-creation with industry partners.
TDK Corporation announces the introduction of the TDK-Lambda brand 1U high MU4 series of AC-DC modular power supplies. The product’s very low acoustic noise is strongly desired in test and medical applications where audible disturbances need to be kept to a minimum.
Rutronik System Solutions expands the existing product portfolio with the new Adapter Board, RAB2 for CO2 Sensing. The board offers a unique approach using CO2 sensors, comparing two ultra-modern sensors from Infineon and Sensirion. That provides the opportunity to use one board in the pre-development phase to evaluate which sensor suits a specific application most.
ROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen Electric Industrial Co., Ltd., (Imasen) for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle.
Diodes Incorporated (Diodes) is introducing its latest PCIe® 3.0 packet switch, the DIODES PI7C9X3G1224GP. A high-performance 12-port, 24-lane device, it can be used in edge computing, data storage, communications infrastructure, and incorporated into host bus adaptors (HBAs), industrial controllers, and network routers.