17
'26
Written on
TME News
17
'26
Written on
ONSEMI News
onsemi Introduces Embedded Power Platform for Higher Power Density
Silicon wafer packaging integrates multiple dies and optimizes electrical, thermal and mechanical performance for AI infrastructure, electric vehicles and industrial applications.
17
'26
Written on
Samsung News
Samsung Launches 245.76TB BM1773 SSD for High-Density AI Data Centers
E3.S QLC SSD combines PCIe 5.0, 4.5GB/s sequential writes, 50K IOPS and enhanced durability for demanding AI workloads.
17
'26
Written on
FESTO News
Configurable Digital I/O Module for Decentralized Automation
Festo introduces the CPX-AP-I-16DIO M12 configurable digital I/O module to optimize decentralized machine architectures and expand connectivity for Mitsubishi PLC environments.
17
'26
Written on
Aetina
Aetina Introduces AIE-KT78/68 for Integrated AI Perception, Decision-Making and Control in Robotics
The new edge AI systems support local multimodal generative AI, LLM, VLM and VLA model execution while connecting high-resolution sensors with motors, joints and actuators through high-bandwidth interfaces and EtherCAT control.
17
'26
Written on
Intel News
Intel Demonstrates AI Inference Gains in MLPerf Inference v6.1 Benchmarks
Results showcase AI inference throughput gains achieved through software stack optimization across Intel Xeon 6 processors and Intel Arc Pro B-series GPUs.
16
'26
Written on
Zel Components News
Alternative Component Distribution in Electronics Manufacturing
Zel Components and partner organizations deploy alternative supply strategies to mitigate electronic component shortages and reduce procurement costs.
16
'26
Written on
IDS Imaging Development Systems GmbH
IDS expands the uEye Live product line with an IP69K-rated model for demanding environments
Featuring a Sony STARVIS 2 8MP sensor and single-cable PoE, the standalone camera delivers high-quality live video streaming through dust, low light, and high-pressure cleaning.
16
'26
Written on
ams OSRAM News
Integrated Optical Sensing Architectures for Mobile Display and Camera Subsystems
ams OSRAM introduces an imaging-to-display sensing architecture combining under-display spectral detection, multi-channel flicker analysis, and direct time-of-flight depth mapping for mobile devices.
16
'26
Written on
Micron News
