01
'26
Written on
STMicroelectronics News
01
'26
Written on
Samsung News
HBM4E memory samples target next-generation AI infrastructure
Samsung Electronics begins shipment of 12-layer HBM4E samples with higher bandwidth, improved energy efficiency and expanded memory capacity for AI computing platforms.
01
'26
Written on
Altech Corporation
Altech Launches Hinge-Type Terminal Block
Innovative Hinged Design Enables Faster Wiring, Easy Inspection and Reliable Power Distribution.
01
'26
Written on
CEA Leti News
3D Chip Stacking Advances AI Interconnect Density
CEA-Leti demonstrates ultra-fine die-to-wafer hybrid bonding technology designed to improve bandwidth and energy efficiency in advanced computing systems.
01
'26
Written on
Microchip News
Microchip Introduces Cost-Optimized Real-Time Control DSCs
The new controller family targets embedded control applications by combining deterministic processing, integrated analog functions, and automotive-grade reliability in a single device.
01
'26
Written on
AEWIN Technologies
Rack-Scale AI Meets Advanced Liquid Cooling
AEWIN combines high-density computing, storage, and thermal management to support growing AI infrastructure demands.
30
'26
Written on
MICRO EPSILON News
Vacuum Sensor Technology for High-Precision Industrial Measurement Tasks
Micro-Epsilon configures non-contact sensors for measurements in the semiconductor industry, optics, and aviation.
30
'26
Written on
AEWIN Technologies
AEWIN Showcases Next-Gen AI Infrastructure Platforms at COMPUTEX 2026
Featuring Intel Xeon 6 and AMD EPYC 9005 platforms, AEWIN delivers high-performance computing, networking, and storage solutions for secure and scalable AI deployments.
29
'26
Written on
Aaronn Electronic GmbH news
Scalable ARM Performance in a COM-HPC Mini Module
Aaronn Electronic introduces the congatec conga-HPC/mIQ-X, a COM-HPC Mini module designed for edge AI, machine vision, and industrial automation applications.
29
'26
Written on
TDK News
