02 {{ "2026-07-02T00:00:00+00:00" | date "MMM" }} '26

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TDK News

Automotive Gate Drive Transformers for High Voltage Vehicle Platforms

TDK Corporation introduces the E13 EM series of compact surface mount transformers for electric vehicle battery isolation systems.

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02 {{ "2026-07-02T00:00:00+00:00" | date "MMM" }} '26

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Molex News

High-Speed Automotive Ethernet Connector System Delivers 25Gbps Network Speeds

Molex has expanded its high-speed interconnect portfolio to meet the growing bandwidth demands of advanced driver-assistance systems and centralized vehicle compute architectures.

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01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

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Toshiba News

Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies

New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications.

Read more…

01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow

Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.

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01 {{ "2026-07-01T00:00:00+00:00" | date "MMM" }} '26

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binder Connector News

binder transforms components into intelligent systems through printed electronics

By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.

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30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26

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Wooptix News

Integration of wavefront phase imaging into semiconductor metrology

Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.

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30 {{ "2026-06-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-30T00:00:00+00:00" | date "longDate" }}

AMD News

AMD's systems-on-chip integrate memory directly

New AMD's SoC integrates up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.

Read more…

29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

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Melexis News

Digital current sensing optimizes signal integrity in automotive traction inverters

Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.

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29 {{ "2026-06-29T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-29T00:00:00+00:00" | date "longDate" }}

Kvaser AB

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

Read more…

25 {{ "2026-06-25T00:00:00+00:00" | date "MMM" }} '26

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Broadcom News

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

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Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Automotive Gate Drive Transformers for High Voltage Vehicle Platforms

TDK Corporation introduces the E13 EM series of compact surface mount transformers for electric vehicle battery isolation systems.

High-Speed Automotive Ethernet Connector System Delivers 25Gbps Network Speeds

Molex has expanded its high-speed interconnect portfolio to meet the growing bandwidth demands of advanced driver-assistance systems and centralized vehicle compute architectures.

Toshiba Launches 80V Power MOSFET for Efficient AI Data Center Power Supplies

New U-MOS11-H-based MOSFET delivers lower power losses, reduced EMI and improved thermal performance for high-density industrial power applications.

Keysight and WIN Semiconductors Launch Joint GaN MMIC Workflow

Keysight Technologies and WIN Semiconductors connect on-chip simulation and evaluation board design to enable first-pass GaN MMIC tapeout success.

binder transforms components into intelligent systems through printed electronics

By directly integrating functional layers onto surfaces, binder enables a new era of compact and highly integrated device architectures.

Integration of wavefront phase imaging into semiconductor metrology

Wooptix installs automated inspection platform at CEA-Leti to advance nanotopography research.

AMD's systems-on-chip integrate memory directly

New AMD's SoC integrates up to 32GB of LPDDR5X memory, delivering higher bandwidth, reduced board area and accelerated system development.

Digital current sensing optimizes signal integrity in automotive traction inverters

Melexis introduces a digital output current sensor to mitigate electromagnetic interference within high-power electric vehicle powertrains.

Introducing the Kvaser PCIe 4xLIN for next-level LIN connectivity

Designed for desktop, industrial, and HIL environments, the low-profile PCIe card integrates galvanic isolation with synchronized timestamping, giving engineers reliable, system-level visibility when testing and debugging LIN networks.

OpenAI and Broadcom Unveil LLM-Optimized Intelligence Processor

OpenAI and Broadcom collaborate to engineer and deploy Jalapeño, a custom artificial intelligence processor optimized for large language model inference workloads.

International