New STM32H7R/S microcontrollers raise embedded-application performance to new levels for next-generation smart devices in factories, buildings, infrastructure, and eHealth.
TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.
Vishay Intertechnology has announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.
The informative virtual Rohde & Schwarz event will span two half days, offering design engineers the opportunity to attend application-oriented presentations delivered by oscilloscope experts. Eight online workshop sessions will provide insights into different day-to-day testing challenges that electronic design engineers face when using oscilloscopes.
Infineon Technologies AG introduces the new CoolSiC™ MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density without compromising the system's reliability even under demanding high voltage and switching frequency conditions.
Keysight will demonstrate its market-leading design, simulation, and test solutions that accelerate the adoption of AI through the validation of high-speed optical and electrical technologies.