14 {{ "2026-08-14T00:00:00+00:00" | date "MMM" }} '26

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Powell Electronics News

Inductive Proximity Sensors for Aerospace Diagnostic Networks

Powell Electronics is supplying non-contact sensing components designed to provide continuous fault detection and target identification within aircraft avionics subsystems.

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13 {{ "2026-08-13T00:00:00+00:00" | date "MMM" }} '26

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Texas Instruments News

TI Introduces First Commercially Available CAN XL Transceiver for Industrial Networks

TCAN6062 enables 20Mbps data rates and 2,048-byte payloads, supporting higher-bandwidth networks while maintaining CAN compatibility and reliable communication.

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13 {{ "2026-08-13T00:00:00+00:00" | date "MMM" }} '26

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EMIS News

EMIS Launches SMF913 and TMF913 HEMP Power Line Filters

Single and three-phase filters protect critical infrastructure from high-altitude electromagnetic pulses and EMI/RFI up to 3000 A.

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12 {{ "2026-08-12T00:00:00+00:00" | date "MMM" }} '26

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TDK News

Programmable DC-DC Converters Span 12 to 48 V Inputs

TDK Corporation expands its industrial power portfolio with programmable isolated DC-DC converters for equipment requiring flexible voltage conversion.

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12 {{ "2026-08-12T00:00:00+00:00" | date "MMM" }} '26

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Microchip News

Microchip Advances Edge AI Sensor Connectivity

Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems while lowering power, cost and integration complexity.

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11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

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Nordic Semiconductor News

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

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11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

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MURATA News

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

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10 {{ "2026-08-10T00:00:00+00:00" | date "MMM" }} '26

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Samsung News

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

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07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

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Molex News

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

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