07
'24
Written on
Analog Devices News
07
'24
Written on
STMicroelectronics News
STMicroelectronics’ high-side switches pack intelligence and efficiency in space-saving outline
Target applications include programmable logic controllers, industrial PC peripherals, and CNC machines.
07
'24
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Diodes Incorporated News
Diodes Unveils Automotive-Compliant 3-Channel Linear LED Driver with Independent Brightness and Color Controls
Diodes Incorporated releases a new automotive-compliant linear LED driver that enables users to independently control the brightness and color of its three channels.
07
'24
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Moxa News
Moxa Helps Elevate Private 5G Operational Performance with Versatile New Gateways
CCG-1500 Gateways feature 5G speeds up to 920 Mbps and serial/Ethernet-to-5G conversion.
07
'24
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AMD News
AMD EXTENDS FPGA PORTFOLIO WITH AMD SPARTAN ULTRASCALE+ FAMILY
The new FPGAs offer high I/O counts, power efficiency, and state-of-the-art security features for embedded vision, healthcare, industrial networking, robotics, and video applications.
07
'24
Written on
STMicroelectronics News
STMICROELECTRONICS REVEALS HIGH-PERFORMANCE, STATE-OF-THE-ART WIRELESS MICROCONTROLLERS
Highly integrated chips support multiple wireless technologies and the latest security standards, perfectly addressing requirements for smart industrial, medical, and consumer devices.
06
'24
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Vishay News
Vishay Intertechnology Inrush Current Limiting PTC Thermistors Increase Performance in Active Charge and Discharge Circuits
For Automotive and Industrial Applications, Self-Protecting Devices Combine R25 Values to 1 kΩ With High Voltages to 1200 VDC and Energy Handling to 240 J.
06
'24
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Infineon News
Infineon introduces CoolSiC™ MOSFET G2, the next generation of silicon carbide technology for high-performance systems that drive decarbonization
Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology.
06
'24
Written on
Samsung News
SAMSUNG DEVELOPS INDUSTRY-FIRST 36GB HBM3E 12H DRAM
HBM3E 12H achieves industry’s largest capacity HBM with groundbreaking 12-layer stack, raising both performance and capacity by more than 50%.
05
'24
Written on
MIkroe News
