01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

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ANSYS News

TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

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TDK News

TDK TO SHOWCASE LATEST INNOVATIONS AT SENSOR+TEST AND PCIM

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

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Rohm Semiconductors News

ROHM’s New Ultra-Low Profile 12W Rated Metal Plate Shunt Resistor: Ideal for Double-Sided Cooled Power Modules in Automotive and Industrial Equipment Applications

0.2Milliohm (PSR100) and 15W class (PSR330) variants in the industry’s smallest* size are also being commercialized.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser Electronics Shines Spotlight on Green Energy Storage Systems in Season Launch of Empowering Innovation Together

Mouser the industry's leading (NPI) distributor with the widest selection of semiconductors and electronic components, kicks off an enlightening new season of the award-winning Empowering Innovation Together (EIT) content series on green energy storage, days before Earth Day 2023.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics added over 15,000 new parts in the first quarter of 2023

Mouser Electronics is focused on introducing new products and technologies to provide customers with an advantage.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Icana News

Picocom and iCana collaborate on 5G Open RAN small cell reference platform

Picocom has announced a strategic partnership to jointly develop a 5G Open RAN Small Cell radio unit reference platform, enabling customers to quickly and cost-effectively bring their products to market.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Arkema News

ARKEMA EXTENDS ITS SUITE OF ADVANCED “INSIDE THE CELL” SOLUTIONS

Arkema has launched the Incellion range of sustainable waterborne acrylic solutions for high-capacity anodes, cathode primers and ceramic coated separators.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

NEXPERIA INTRODUCES THE BEST-IN-CLASS PORTFOLIO OF I2C GPIO EXPANDERS

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

TDK TO SHOWCASE LATEST INNOVATIONS AT SENSOR+TEST AND PCIM

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

ROHM’s New Ultra-Low Profile 12W Rated Metal Plate Shunt Resistor: Ideal for Double-Sided Cooled Power Modules in Automotive and Industrial Equipment Applications

0.2Milliohm (PSR100) and 15W class (PSR330) variants in the industry’s smallest* size are also being commercialized.

Mouser Electronics Shines Spotlight on Green Energy Storage Systems in Season Launch of Empowering Innovation Together

Mouser the industry's leading (NPI) distributor with the widest selection of semiconductors and electronic components, kicks off an enlightening new season of the award-winning Empowering Innovation Together (EIT) content series on green energy storage, days before Earth Day 2023.

Mouser Electronics added over 15,000 new parts in the first quarter of 2023

Mouser Electronics is focused on introducing new products and technologies to provide customers with an advantage.

Picocom and iCana collaborate on 5G Open RAN small cell reference platform

Picocom has announced a strategic partnership to jointly develop a 5G Open RAN Small Cell radio unit reference platform, enabling customers to quickly and cost-effectively bring their products to market.

ARKEMA EXTENDS ITS SUITE OF ADVANCED “INSIDE THE CELL” SOLUTIONS

Arkema has launched the Incellion range of sustainable waterborne acrylic solutions for high-capacity anodes, cathode primers and ceramic coated separators.

NEXPERIA INTRODUCES THE BEST-IN-CLASS PORTFOLIO OF I2C GPIO EXPANDERS

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

International