08 {{ "2023-05-08T00:00:00+00:00" | date "MMM" }} '23

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Sivers Semiconductors News

Sivers Semiconductors PARALIA aims to develop fundamental innovations for automotive and aerospace applications

PARALIA is a new EU Horizon Research and Innovation Actions Project funded under the HORIZON-CL4-2022-DIGITAL-EMERGING-01-03 Call, coordinated by Aristotle University of Thessaloniki in Greece. It will run from January 2023 to June 2026.

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05 {{ "2023-05-05T00:00:00+00:00" | date "MMM" }} '23

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Exxelia

JUICE Mission to Jupiter: Exxelia high reliability passive components ready to withstand extreme space conditions

Exxelia, one of the world leaders in high-performance passive component design and manufacturing, is proud to announce that its capacitors and magnetics have been selected for use in the European Space Agency's (ESA) JUICE (Jupiter Icy Moons Explorer) mission.

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05 {{ "2023-05-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-05T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Expands Sensor Portfolio to Offer More Real-World Interaction

Mouser Electronics, Inc, recently added several new sensor products to its already comprehensive sensing portfolio.

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05 {{ "2023-05-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-05T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon's new wireless power transmitter IC is ideal for charging up to 50 W

Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.

Read more…

05 {{ "2023-05-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-05T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Rutronik and KEMET's T598 Automotive Series expands portfolio for maximum value

KEMET introduces capacitors with the highest capacitance and lowest ESR values for automotive-qualified polymer capacitors, AEC-Q200 certified.

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04 {{ "2023-05-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-04T00:00:00+00:00" | date "longDate" }}

Deltaq News

Delta-Q Technologies has begun full production of its 3.3 kW battery charger

The XV3300 battery charger is a 3-in-1 on-board charging system offering stellar performance and features, suited for non-road mobile machinery.

Read more…

04 {{ "2023-05-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-04T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon further diversifies its silicon carbide supplier base; new supplier agreement with SICC on wafers and boules

Infineon Technologies AG has signed an agreement with Chinese silicon carbide (SiC) supplier SICC to diversify Infineon's SiC material supplier base and to secure additional competitive SiC sources.

Read more…

04 {{ "2023-05-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-04T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu–MediaTek Collaboration Successfully Verified Wi-Fi 7 Chip Connection with Network Mode

Anritsu Corporation and MediaTek Incorporated (MediaTek) have successfully verified the performance and functions of MediaTek’s Filogic chip for IEEE802.11be wireless LAN (WLAN) by testing RF characteristics with the network mode.

Read more…

04 {{ "2023-05-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-04T00:00:00+00:00" | date "longDate" }}

Leuze

Leuze announces a change of management

Leuze is placing its strong growth on a broader footing and has expanded its executive management. Xavier Hamers joined the company on April 1, 2023.

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03 {{ "2023-05-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-03T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz

Rohde & Schwarz demonstrates solutions for particle accelerators at IPAC’23 in Venice

Particle accelerators are a key element in much of today’s cutting-edge research, including fundamental scientific research or applied disciplines such as materials science or medicine. The 14th International Particle Accelerator Conference allows visitors to gain insight into the latest developments from around the world.

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Technical Articles

75 GB/s Data Acquisition to Disk

Sivers Semiconductors PARALIA aims to develop fundamental innovations for automotive and aerospace applications

PARALIA is a new EU Horizon Research and Innovation Actions Project funded under the HORIZON-CL4-2022-DIGITAL-EMERGING-01-03 Call, coordinated by Aristotle University of Thessaloniki in Greece. It will run from January 2023 to June 2026.

JUICE Mission to Jupiter: Exxelia high reliability passive components ready to withstand extreme space conditions

Exxelia, one of the world leaders in high-performance passive component design and manufacturing, is proud to announce that its capacitors and magnetics have been selected for use in the European Space Agency's (ESA) JUICE (Jupiter Icy Moons Explorer) mission.

Mouser Expands Sensor Portfolio to Offer More Real-World Interaction

Mouser Electronics, Inc, recently added several new sensor products to its already comprehensive sensing portfolio.

Infineon's new wireless power transmitter IC is ideal for charging up to 50 W

Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.

Rutronik and KEMET's T598 Automotive Series expands portfolio for maximum value

KEMET introduces capacitors with the highest capacitance and lowest ESR values for automotive-qualified polymer capacitors, AEC-Q200 certified.

Delta-Q Technologies has begun full production of its 3.3 kW battery charger

The XV3300 battery charger is a 3-in-1 on-board charging system offering stellar performance and features, suited for non-road mobile machinery.

Infineon further diversifies its silicon carbide supplier base; new supplier agreement with SICC on wafers and boules

Infineon Technologies AG has signed an agreement with Chinese silicon carbide (SiC) supplier SICC to diversify Infineon's SiC material supplier base and to secure additional competitive SiC sources.

Anritsu–MediaTek Collaboration Successfully Verified Wi-Fi 7 Chip Connection with Network Mode

Anritsu Corporation and MediaTek Incorporated (MediaTek) have successfully verified the performance and functions of MediaTek’s Filogic chip for IEEE802.11be wireless LAN (WLAN) by testing RF characteristics with the network mode.

Leuze announces a change of management

Leuze is placing its strong growth on a broader footing and has expanded its executive management. Xavier Hamers joined the company on April 1, 2023.

Rohde & Schwarz demonstrates solutions for particle accelerators at IPAC’23 in Venice

International