Exxelia, a designer and manufacturer of high-reliability passive electronic components, announces its participation in the 55th edition of the International Paris Air Show (SIAE 2025).
Keysight’s Electromagnetic Simulator and Synopsys’ AI-powered RF design migration flow, provide an efficient, integrated radio frequency circuit re-design solution.
binder enhances component reliability with custom PUR foaming and potting processes, ensuring optimal protection for sensitive electromechanical and electronic assemblies.
Micron’s 1-gamma LPDDR5X delivers industry-leading 10.7Gbps speed, 20% power savings, and the thinnest package, enabling faster, energy-efficient AI on flagship smartphones.
JUMPtec unveils new COM and SMARC modules powered by Intel Core 3 and N-Series processors, delivering enhanced performance for embedded and edge computing applications.
Comau will work with Intecells to develop a cost-effective technology path for customers looking to integrate the new technology within existing cell manufacturing lines.
Murata’s NXJ1T series offers compact, high-isolation 1W DC-DC converters for demanding industrial, medical, and energy applications with exceptional reliability.
With the IMX675 (5 MP), IMX676 (12.5 MP) and IMX678 (8 MP) sensor variants, IDS will soon be able to offer further high-performance options for a wide range of requirements.
Würth Elektronik's Skoll-I is a compact, certified module combining Bluetooth Classic and LE 5.4, enabling fast, global deployment of new wireless applications.