16 {{ "2026-09-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-16T00:00:00+00:00" | date "longDate" }}

ams OSRAM News

Integrated Optical Sensing Architectures for Mobile Display and Camera Subsystems

ams OSRAM introduces an imaging-to-display sensing architecture combining under-display spectral detection, multi-channel flicker analysis, and direct time-of-flight depth mapping for mobile devices.

Read more…

16 {{ "2026-09-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-16T00:00:00+00:00" | date "longDate" }}

Micron News

Micron Demonstrates World’s First 512GB DDR5 RDIMM for Next-Generation Servers

Advanced vertical-interconnect packaging enables speeds up to 9,200 MT/s, 12TB server memory capacity and over 60% lower power consumption.

Read more…

16 {{ "2026-09-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-16T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Expands Ultra-Compact Snap-In Capacitors with 500 V Rating for AI Servers

B43645 through B43661 series offer 80–2060 µF capacitance, up to 5.39 A ripple current and 5,000-hour life at 105°C.

Read more…

16 {{ "2026-09-16T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-16T00:00:00+00:00" | date "longDate" }}

Microchip News

AnalogAI Licenses Microchip’s SST memBrain SAGE IP for Edge Processors

AnalogAI has selected the memBrain SAGE neuromorphic compute-in-memory IP from Microchip subsidiary SST to power real-world edge AI processors operating at or below one watt.

Read more…

15 {{ "2026-09-15T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-15T00:00:00+00:00" | date "longDate" }}

NeoCortec News

Wireless Mesh Protocol Deployment for Smart Meters

NeoCortec and Semtech showcase integrated wireless mesh technology for smart metering infrastructure at Electronica India.

Read more…

14 {{ "2026-09-14T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-14T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Cloud-Based Design Software Platform for European Semiconductor Enterprises

Keysight Technologies provides specialized software tools for European semiconductor start-ups via the European Chips Design Platform.

Read more…

11 {{ "2026-09-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-11T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Advanced Power-Factor Correction Controller for High-Power Switched-Mode Power Supplies

STMicroelectronics introduces the L4983 controller for continuous conduction mode power-factor correction systems utilized in industrial, medical, server, and consumer electronics applications.

Read more…

11 {{ "2026-09-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-11T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM High Surge 0402 Chip Resistors

ROHM introduces the SDR01 series of high surge chip resistors, providing a 0.33 W power rating to reduce power circuit board space.

Read more…

11 {{ "2026-09-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-11T00:00:00+00:00" | date "longDate" }}

TDK News

Non-Isolated Three-Phase Power Conversion for Distributed High-Voltage Architectures

TDK Corporation has introduced a high-capacity power supply platform engineered to deliver regulated direct-current distribution across industrial automation and computing systems.

Read more…

11 {{ "2026-09-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-11T00:00:00+00:00" | date "longDate" }}

Samsung News

Co-Optimized Semiconductor Design Platform for Advanced Node Artificial Intelligence

Cadence Design Systems & Samsung Foundry have expanded their technical partnership to provide certified design flows for 2-nanometer gate-all-around fabrication.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Integrated Optical Sensing Architectures for Mobile Display and Camera Subsystems

ams OSRAM introduces an imaging-to-display sensing architecture combining under-display spectral detection, multi-channel flicker analysis, and direct time-of-flight depth mapping for mobile devices.

Micron Demonstrates World’s First 512GB DDR5 RDIMM for Next-Generation Servers

Advanced vertical-interconnect packaging enables speeds up to 9,200 MT/s, 12TB server memory capacity and over 60% lower power consumption.

TDK Expands Ultra-Compact Snap-In Capacitors with 500 V Rating for AI Servers

B43645 through B43661 series offer 80–2060 µF capacitance, up to 5.39 A ripple current and 5,000-hour life at 105°C.

AnalogAI Licenses Microchip’s SST memBrain SAGE IP for Edge Processors

AnalogAI has selected the memBrain SAGE neuromorphic compute-in-memory IP from Microchip subsidiary SST to power real-world edge AI processors operating at or below one watt.

Wireless Mesh Protocol Deployment for Smart Meters

NeoCortec and Semtech showcase integrated wireless mesh technology for smart metering infrastructure at Electronica India.

Cloud-Based Design Software Platform for European Semiconductor Enterprises

Keysight Technologies provides specialized software tools for European semiconductor start-ups via the European Chips Design Platform.

Advanced Power-Factor Correction Controller for High-Power Switched-Mode Power Supplies

STMicroelectronics introduces the L4983 controller for continuous conduction mode power-factor correction systems utilized in industrial, medical, server, and consumer electronics applications.

ROHM High Surge 0402 Chip Resistors

ROHM introduces the SDR01 series of high surge chip resistors, providing a 0.33 W power rating to reduce power circuit board space.

Non-Isolated Three-Phase Power Conversion for Distributed High-Voltage Architectures

TDK Corporation has introduced a high-capacity power supply platform engineered to deliver regulated direct-current distribution across industrial automation and computing systems.

Co-Optimized Semiconductor Design Platform for Advanced Node Artificial Intelligence

Cadence Design Systems & Samsung Foundry have expanded their technical partnership to provide certified design flows for 2-nanometer gate-all-around fabrication.

International