Powered by Intel Core i3-N305, this 23.8” fanless system features IP66 protection, dual 2.5GbE LAN, wide voltage input, and versatile mounting for harsh industrial environments.
Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.
Supporting 8.2–44 V and up to 4 A output, the compact Click board integrates PWM current drive, torque adjustment, fault monitoring, and rapid prototyping for industrial robotics.
Weighing just 36 g, the smallest DC relay in the industry, Omron’s G9JH-1-E, available via Rutronik, withstands 100,000+ switches, 30 A inrush, -40 °C to +85 °C, and 4,500 V impulse.
Mutual adoption of top-side cooling and DOT-247 packages enhances thermal performance, doubles power density, and provides customers with interchangeable SiC solutions for EV, AI, and renewable applications.
Avalue's BMX-P820 barebone system supports Intel 14th Gen CPUs, DDR5 memory, and PCIe expansion for AI acceleration, operating below 40dB for industrial automation.
Quantic Evans’ EVANSCAPS hybrid capacitors, ranging from 68μF–300,000μF and 10–150VDC, deliver high reliability, low ESR, and SWaP advantages for aerospace, defence, energy, and industrial applications.