08 {{ "2026-09-08T00:00:00+00:00" | date "MMM" }} '26

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Wernerwirth News

Reliability in Electronics Manufacturing

WERNER WIRTH, alongside its partners, is developing integrated solutions for connection technology and component protection at electronica 2026 in Munich to realize the All Electric Society.

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04 {{ "2026-09-04T00:00:00+00:00" | date "MMM" }} '26

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Siemens News

NanoBridge Adopts Siemens FPGA Synthesis for Advanced Semiconductor Development

Optimized design workflows support low-power, harsh-environment FPGA devices for aerospace, automotive and critical infrastructure applications.

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04 {{ "2026-09-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-04T00:00:00+00:00" | date "longDate" }}

Anritsu News

Verification of Rel-17 Coverage Enhancements for 5G Network Infrastructure

Anritsu and MediaTek have validated new protocol conformance testcases to ensure reliable multi-slot uplink data transmission in weak signal environments.

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04 {{ "2026-09-04T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

Keysight to Showcase Expanded PNT Capabilities at ION GNSS+ 2026

Keysight experts will show how intelligent insights and advanced test solutions can reduce development risk, accelerate validation, and speed time-to-market.

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03 {{ "2026-09-03T00:00:00+00:00" | date "MMM" }} '26

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Trumpf News

Ionized Sputtering for Glass Substrate Packaging

TRUMPF introduces an industrial plasma generation process designed to coat high-density through-glass vias, facilitating rapid data transmission in artificial intelligence processors.

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03 {{ "2026-09-03T00:00:00+00:00" | date "MMM" }} '26

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Würth Elektronik News

High-Speed Optocoupler WL-OCHS for Digital Signal Transmission

Würth Elektronik presents the high-speed optocoupler WL-OCHS for secure, galvanically isolated signal transmission in interference-prone industrial and medical applications.

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03 {{ "2026-09-03T00:00:00+00:00" | date "MMM" }} '26

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Seco News

SECO Industrial HMI and SBC Dragonwing IQ-2390

SECO introduces the Compact Vision 5 Dragonwing IQ-2390 HMI and SBC-Dragonwing-IQ-2390 to modernize compact embedded industrial systems with on-device AI.

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02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

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Rutronik News

Rutronik & Nanopower Partner to Expand Ultra-Low-Power IoT Portfolio

Nanoampere-range power-saving ICs support energy-autonomous sensors, extending battery life and enabling battery-free designs across connected applications.

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02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

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Trumpf News

TRUMPF Showcases Integrated AI Chip Cooling Technology at Semicon Taiwan 2026

Ultrashort-pulse lasers create microscopic cooling structures directly within chip stacks, addressing heat dissipation challenges in advanced semiconductor packaging.

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02 {{ "2026-09-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-02T00:00:00+00:00" | date "longDate" }}

Alps Alpine News

Electromechanical Switches for Advanced Vehicle Energy Networks

Alps Alpine introduces a new detection component designed to handle elevated power loads and simplify circuit layouts in electrified transportation platforms.

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WERNER WIRTH, alongside its partners, is developing integrated solutions for connection technology and component protection at electronica 2026 in Munich to realize the All Electric Society.

Optimized design workflows support low-power, harsh-environment FPGA devices for aerospace, automotive and critical infrastructure applications.

Anritsu and MediaTek have validated new protocol conformance testcases to ensure reliable multi-slot uplink data transmission in weak signal environments.

Keysight experts will show how intelligent insights and advanced test solutions can reduce development risk, accelerate validation, and speed time-to-market.

TRUMPF introduces an industrial plasma generation process designed to coat high-density through-glass vias, facilitating rapid data transmission in artificial intelligence processors.

Würth Elektronik presents the high-speed optocoupler WL-OCHS for secure, galvanically isolated signal transmission in interference-prone industrial and medical applications.

SECO introduces the Compact Vision 5 Dragonwing IQ-2390 HMI and SBC-Dragonwing-IQ-2390 to modernize compact embedded industrial systems with on-device AI.

Nanoampere-range power-saving ICs support energy-autonomous sensors, extending battery life and enabling battery-free designs across connected applications.

Ultrashort-pulse lasers create microscopic cooling structures directly within chip stacks, addressing heat dissipation challenges in advanced semiconductor packaging.

Alps Alpine introduces a new detection component designed to handle elevated power loads and simplify circuit layouts in electrified transportation platforms.

International