11 {{ "2026-09-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-11T00:00:00+00:00" | date "longDate" }}

Same Sky Devices News

Same Sky Expands SPG Thermoelectric Generator Product Family

Same Sky has broadened its SPG thermoelectric generator (TEG) module line with expanded package dimensions and power ratings up to 27.3 W for industrial waste heat energy recovery.

Read more…

10 {{ "2026-09-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-10T00:00:00+00:00" | date "longDate" }}

Pickering News

Low-Thermal EMF Reed Relays for Precision Signal Switching

Pickering Electronics Series 120 relays reduce thermal EMF offsets in high-density automated test equipment and semiconductor data acquisition systems.

Read more…

10 {{ "2026-09-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-10T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Launches Pin-Compatible 64-Bit MPUs for Advanced HMI & IoT

RZ/G3L and RZ/G3SE combine up to four Cortex-A55 cores, 1 mW standby power, PCIe and TSN Ethernet for scalable edge systems.

Read more…

10 {{ "2026-09-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-10T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Launches 1.2 V Clock Buffers for Advanced SoCs & FPGAs

SY757xx buffers provide voltage translation, ultra-low jitter and broad frequency support, simplifying clock distribution while reducing components and preserving signal integrity.

Read more…

10 {{ "2026-09-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-10T00:00:00+00:00" | date "longDate" }}

CEVA News

Ceva and LG Electronics Partner for Complete UWB Platform

Ceva and LG Electronics collaborate to integrate baseband IP and RF technologies into a silicon-ready Ultra-Wideband platform for automotive, industrial, and consumer SoCs.

Read more…

10 {{ "2026-09-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-10T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Fraunhofer IPMS Develops MEMS Spatial Light Modulators

Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.

Read more…

09 {{ "2026-09-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-09T00:00:00+00:00" | date "longDate" }}

Anritsu News

High-Speed Test Solutions for AI Infrastructure

Anritsu demonstrates advanced test and measurement solutions at ECOC 2026 in Malaga, Spain, to validate high-speed optical and digital networks for artificial intelligence applications.

Read more…

09 {{ "2026-09-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-09T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems

New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.

Read more…

09 {{ "2026-09-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-09T00:00:00+00:00" | date "longDate" }}

ARROW News

Arrow Enables Remote Evaluation of NXP Ara240 Edge AI Accelerator

Digital Test Drive gives engineers hands-on access to AI workloads for computer vision, generative AI and multimodal edge applications before hardware investment.

Read more…

08 {{ "2026-09-08T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-09-08T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Integration of advanced battery management systems

STMicroelectronics collaborates with industrial manufacturers to deploy precision lithium-battery management integrated circuits for portable equipment.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Same Sky Expands SPG Thermoelectric Generator Product Family

Same Sky has broadened its SPG thermoelectric generator (TEG) module line with expanded package dimensions and power ratings up to 27.3 W for industrial waste heat energy recovery.

Low-Thermal EMF Reed Relays for Precision Signal Switching

Pickering Electronics Series 120 relays reduce thermal EMF offsets in high-density automated test equipment and semiconductor data acquisition systems.

Renesas Launches Pin-Compatible 64-Bit MPUs for Advanced HMI & IoT

RZ/G3L and RZ/G3SE combine up to four Cortex-A55 cores, 1 mW standby power, PCIe and TSN Ethernet for scalable edge systems.

Microchip Launches 1.2 V Clock Buffers for Advanced SoCs & FPGAs

SY757xx buffers provide voltage translation, ultra-low jitter and broad frequency support, simplifying clock distribution while reducing components and preserving signal integrity.

Ceva and LG Electronics Partner for Complete UWB Platform

Ceva and LG Electronics collaborate to integrate baseband IP and RF technologies into a silicon-ready Ultra-Wideband platform for automotive, industrial, and consumer SoCs.

Fraunhofer IPMS Develops MEMS Spatial Light Modulators

Fraunhofer IPMS will present microelectromechanical spatial light modulators (SLMs) and customer evaluation kits for high-speed photonic applications at Photonix Japan 2026.

High-Speed Test Solutions for AI Infrastructure

Anritsu demonstrates advanced test and measurement solutions at ECOC 2026 in Malaga, Spain, to validate high-speed optical and digital networks for artificial intelligence applications.

TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems

New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.

Arrow Enables Remote Evaluation of NXP Ara240 Edge AI Accelerator

Digital Test Drive gives engineers hands-on access to AI workloads for computer vision, generative AI and multimodal edge applications before hardware investment.

Integration of advanced battery management systems

STMicroelectronics collaborates with industrial manufacturers to deploy precision lithium-battery management integrated circuits for portable equipment.

International