13 {{ "2026-08-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-13T00:00:00+00:00" | date "longDate" }}

EMIS News

EMIS Launches SMF913 and TMF913 HEMP Power Line Filters

Single and three-phase filters protect critical infrastructure from high-altitude electromagnetic pulses and EMI/RFI up to 3000 A.

Read more…

12 {{ "2026-08-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-12T00:00:00+00:00" | date "longDate" }}

TDK News

Programmable DC-DC Converters Span 12 to 48 V Inputs

TDK Corporation expands its industrial power portfolio with programmable isolated DC-DC converters for equipment requiring flexible voltage conversion.

Read more…

12 {{ "2026-08-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-12T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Advances Edge AI Sensor Connectivity

Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems while lowering power, cost and integration complexity.

Read more…

11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

Nordic Semiconductor News

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

Read more…

11 {{ "2026-08-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-11T00:00:00+00:00" | date "longDate" }}

MURATA News

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

Read more…

10 {{ "2026-08-10T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-10T00:00:00+00:00" | date "longDate" }}

Samsung News

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Molex News

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Pickering News

High-Current LXI Switching Systems for Automated Power Testing

Pickering Interfaces introduces a standardized hardware architecture designed to route high-voltage signals and manage power supplies within the automotive data ecosystem.

Read more…

07 {{ "2026-08-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-07T00:00:00+00:00" | date "longDate" }}

Power Integrations News

2200 V Gallium Nitride Scales High-Voltage Power Systems

Power Integrations introduces a high-voltage semiconductor solution designed to support advanced power conversion demands in data centers and renewable infrastructure.

Read more…

06 {{ "2026-08-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-06T00:00:00+00:00" | date "longDate" }}

Samsung News

Next-Generation Vertically Stacked Memory Architectures For Artificial Intelligence Infrastructure

Samsung Electronics introduces advanced hybrid bonding technologies and ultra-high-layer storage components to maximize bandwidth efficiency in parallel computing systems.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

EMIS Launches SMF913 and TMF913 HEMP Power Line Filters

Single and three-phase filters protect critical infrastructure from high-altitude electromagnetic pulses and EMI/RFI up to 3000 A.

Programmable DC-DC Converters Span 12 to 48 V Inputs

TDK Corporation expands its industrial power portfolio with programmable isolated DC-DC converters for equipment requiring flexible voltage conversion.

Microchip Advances Edge AI Sensor Connectivity

Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems while lowering power, cost and integration complexity.

Satellite and Cellular Connectivity Certification for Digital Infrastructure

Nordic Semiconductor and LooUQ obtain satellite network certification for embedded modems to accelerate dual-mode cellular and satellite IoT deployment across remote industrial infrastructure.

Murata Heads to Hot Chips 2026

At Hot Chips 2026, taking place August 23-25 in Palo Alto, California, Murata will showcase the technologies powering AI at the last millimeter.

Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

Compact Hybrid Connectors Simplify Humanoid Robot Joint Wiring

Molex combines 15 A power delivery and 1 Gbps Ethernet in a 5.65 mm routing profile for humanoid robots, AMRs and industrial automation systems.

High-Current LXI Switching Systems for Automated Power Testing

Pickering Interfaces introduces a standardized hardware architecture designed to route high-voltage signals and manage power supplies within the automotive data ecosystem.

2200 V Gallium Nitride Scales High-Voltage Power Systems

Power Integrations introduces a high-voltage semiconductor solution designed to support advanced power conversion demands in data centers and renewable infrastructure.

Next-Generation Vertically Stacked Memory Architectures For Artificial Intelligence Infrastructure

Samsung Electronics introduces advanced hybrid bonding technologies and ultra-high-layer storage components to maximize bandwidth efficiency in parallel computing systems.

International